Workpiece Dividing Apparatus with Dual-Sided Segmented Pressing
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Solution Overview
Problem
Existing methods for dividing plate-shaped workpieces along projected dicing lines often result in chippings from the edges of the chips due to the three-point breaking process, which is inefficient and produces unwanted edge chippings.
Innovation Solution
A dividing apparatus that includes a frame holding unit, a detecting unit, a dividing unit with a holder and presser mechanism, and a moving mechanism to support and press the workpiece from both surfaces, preventing edge chippings by holding one region and pressing the adjacent region to divide the workpiece along the projected dicing line.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the three-point breaking process is used with a blade pressing the workpiece from above, then the workpiece can be divided along the projected dicing line, but chippings are produced from the edges of the chips due to the adjacent sides moving away
Solution Approach 1:
The pressing action is segmented into two independent holders: a first holder that pushes upward from below the workpiece and a second holder that presses from above. This segmentation allows each holder to independently control one region adjacent to the dicing line, preventing the chips from moving away and eliminating edge chippings while maintaining division efficiency.
Solution Approach 2:
The support structure is extended from a single-sided pressing mechanism to a dual-sided mechanism, with the first holder operating from the lower surface and the second holder operating from the upper surface. This dimensional extension provides balanced support on both sides of the workpiece, preventing chip displacement and eliminating edge chippings.
2Device complexity
If both adjacent sides of the projected dicing line are supported at two points with a single pressing action, then the division process is simple, but the chips move away from the pressed area causing edge chippings
Solution Approach 1:
The pressing mechanism is segmented into two independent holders positioned on opposite sides of the workpiece. The first holder pushes upward from below while the second holder presses from above, with each holder independently supporting one region adjacent to the dicing line. This segmentation prevents chip displacement and eliminates edge chippings.
Solution Approach 2:
The workpiece itself acts as an intermediary between the two holders, with the first holder pushing upward through the protective tape and the second holder pressing downward from above. This intermediary arrangement allows balanced support on both sides, preventing the chips from moving away and eliminating edge chippings.
Data Source
AI summary
A dividing apparatus divides a workpiece along projected dicing lines into chips, the workpiece being stuck to an upper surface of a protective tape mounted on an annular frame. The dividing apparatus includes a frame holding unit for holding the annular frame and a dividing unit for pressing the workpiece in the vicinity of one at a time of the projected dicing lines and dividing the workpiece into chips along the projected dicing line. The dividing unit includes a holder for holding a portion of the workpiece in the vicinity of the projected dicing line where the workpiece is to be broken, from both upper and lower surfaces of the workpiece, and a presser for pressing chips next to chips held by the holder across the projected dicing line where the workpiece is to be broken, thereby to divide the workpiece along the projected dicing line.