Dolmen Support Piece Laminate Film for Simpler Singulation
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Solution Overview
Problem
The existing methods for manufacturing support pieces for semiconductor devices with a dolmen structure are inefficient and costly, requiring multiple processes including back grinding and dicing of semiconductor wafers, which complicates the production and increases costs.
Innovation Solution
A manufacturing method using a laminate film with a base material, an adhesive layer, and a support piece formation film, where the support pieces are formed by singulating a thermosetting resin layer or a metal layer, allowing for improved pickup properties and reduced process complexity by omitting back grinding and dicing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor wafers are used to manufacture support pieces through back grinding and dicing processes, then the support pieces can be obtained with required mechanical properties, but the manufacturing process becomes complex and costly
Solution Approach 1:
The patent replaces expensive semiconductor wafers with a cost-effective laminate film structure consisting of a base material film, adhesive layer, and support piece formation film. This substitution maintains the required mechanical and pickup properties while dramatically reducing material costs and eliminating complex semiconductor manufacturing processes such as back grinding and dicing.
Solution Approach 2:
The patent employs a composite laminate film structure where a base material film provides mechanical strength, an adhesive layer ensures bonding, and a support piece formation film (containing thermosetting resin) delivers the required pickup properties. This composite approach allows each layer to contribute its optimal properties, achieving reliable support piece performance without using expensive semiconductor materials.
2Manufacturing precision
If multiple processes including back grinding and dicing are used to manufacture support pieces, then the support pieces can be produced with required precision, but the production efficiency decreases and costs increase
Solution Approach 1:
The patent segments the support piece manufacturing into a simple lamination process where pre-formed support pieces are embedded in the support piece formation film during lamination with the base material film and adhesive layer. This eliminates the need for post-manufacturing processes such as back grinding and dicing, thereby maintaining precision while dramatically improving production efficiency.
Solution Approach 2:
The support pieces are prepared in advance and embedded in the support piece formation film before lamination. This preliminary action ensures that the support pieces are already positioned and configured with required precision, eliminating the need for subsequent precision-critical processes like dicing and back grinding, thus improving both precision and productivity.
3Strength
If semiconductor wafers are used as support pieces, then the required mechanical strength can be achieved, but the cost of production increases significantly
Solution Approach 1:
The patent replaces expensive semiconductor wafers with a cost-effective laminate film structure where the base material film provides mechanical strength, the adhesive layer ensures bonding, and the support piece formation film delivers required pickup properties. This substitution maintains necessary strength while dramatically reducing material costs.
Solution Approach 2:
The patent uses a composite laminate structure where each layer contributes specific properties: the base material film provides mechanical strength, the adhesive layer ensures bonding, and the support piece formation film (with thermosetting resin) delivers pickup properties. This composite approach achieves required strength at lower cost compared to using semiconductor wafers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the production of support pieces with excellent pickup properties, reducing costs by eliminating the need for expensive semiconductor wafers and minimizing the risk of pickup errors, while enhancing the visibility and mechanical strength of the support pieces.
Implementation Method 1
a film including a thermosetting resin layer; a film including a layer in which at least a part of a thermosetting resin layer is cured
Data Source
AI summary
One aspect of the present disclosure is a manufacturing method for a support piece used in the formation of a dolmen structure in a semiconductor device, including processes of: (A) preparing a laminate film including a base material film, an adhesive layer, and a support piece formation film, for example, including a thermosetting resin layer, in this order; and (B) forming support pieces on a surface of the adhesive layer by singulating the support piece formation film, in which the process (B) includes a process of forming a cut in the support piece formation film partway in a thickness direction, and a process of singulating the support piece formation film in a cooled state by expansion, in this order.