Double Insulation Layers Single Mask Process
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Solution Overview
Problem
The existing semiconductor manufacturing processes for forming double insulation layers in organic light emitting displays require multiple mask processes, increasing manufacturing cost and time, and potentially damaging the devices due to additional etching and washing processes.
Innovation Solution
A method to form double insulation layers with different patterns using a single mask process, where a first insulation layer is coated on a substrate, followed by a second insulation layer with a photosensitive material, and then patterned to create regions with varying thicknesses and patterns, allowing for the overlap, absence, or single presence of the layers in specific regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple mask processes are used to form double insulation layers with different patterns, then the insulation layers can be formed with distinct patterns, but the manufacturing cost and time increase
Solution Approach 1:
The patent combines multiple mask processes into a single mask process by forming both the first and second insulation layers with different patterns simultaneously. The method involves coating a first insulation layer, then coating a second insulation layer with a photosensitive material over the first layer, and performing a single exposure and development process to create different patterns in each layer using the same mask, thereby reducing manufacturing time while maintaining pattern precision
Solution Approach 2:
The patent applies preliminary action by pre-coating both insulation layers before patterning, with the second layer containing a photosensitive material that enables pattern formation during the subsequent single exposure process. This preliminary preparation allows the single mask process to achieve what would otherwise require multiple sequential mask processes
2Manufacturing precision
If multiple mask processes are used to form double insulation layers, then different patterns can be achieved, but the manufacturing cost increases
Solution Approach 1:
The patent merges multiple mask processes into one by utilizing the photosensitive material in the second insulation layer that can be patterned simultaneously with the first insulation layer during a single exposure and development cycle. This consolidation reduces the number of mask alignment steps, equipment usage, and process complexity, thereby lowering manufacturing cost while maintaining the ability to form different patterns in each insulation layer
3Manufacturing precision
If additional etching and washing processes are performed, then double insulation layers can be formed, but device damage may occur
Solution Approach 1:
The patent extracts or eliminates the additional etching and washing processes that are typically required in multiple mask processes. By using a single mask process with a photosensitive second insulation layer, the method directly forms the desired patterns through exposure and development without requiring aggressive etching steps, thereby reducing the risk of device damage while still achieving proper insulation layer formation
Solution Approach 2:
The patent converts the potential harm of multiple etching processes into a benefit by using the photosensitive material's chemical properties during a single exposure process. The photosensitive material undergoes controlled chemical changes upon exposure to light, enabling pattern formation without the need for harsh etching steps that could damage the device, thus turning what would be a harmful multi-step process into a benign single-step process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of manufacturing processes and costs, while minimizing damage to the semiconductor device by using a single mask process to create double insulation layers with distinct patterns, enhancing the efficiency and reliability of the organic light emitting display production.
Implementation Method 1
a second insulation layer with a photosensitive material, and then patterned to create regions with varying thicknesses and patterns
Data Source
AI summary
Disclosed are a semiconductor device, which forms two insulation layers having different patterns by one mask process, and a method of manufacturing the same. In a semiconductor device having double insulation layers, a photosensitive material is included in an upper insulation layer. During a manufacture of the semiconductor device, the photosensitive material is used as a photo resist layer in order to reduce the number of masks.