Double-Layer Chip Fixing Device with Reinforcing Piece
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Solution Overview
Problem
The uneven surface areas of CPU chips in 5G AI boxes lead to uneven force distribution when housed, potentially causing cracks or deformations due to the housing's contact on both sides, which affects heat dissipation and operational stability.
Innovation Solution
A fixing device comprising a circuit board, a first cover, a reinforcing piece, and a double-layer chip with thermal conductive bumps that distribute forces evenly and enhance heat dissipation by conducting heat to cooling fins, using a reinforcing piece to surround the opening and separate forces applied to the chip, preventing deformation and cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the housing contacts both sides of the CPU, then heat dissipation is improved, but uneven forces are exerted on the CPU causing cracks or deformations
Solution Approach 1:
A reinforcing piece is introduced as an intermediary component between the housing and the circuit board. This reinforcing piece has a first contact surface that contacts the first surface of the circuit board and a second contact surface that contacts the second surface of the circuit board, thereby mediating the force transmission and preventing direct contact between the housing and the CPU, which resolves the contradiction between heat dissipation and structural integrity
Solution Approach 2:
The reinforcing piece is made of a material with different mechanical properties than the circuit board and CPU, creating a composite structure that can withstand compressive forces while protecting the CPU. This composite approach allows the system to achieve both heat dissipation through the housing and protection of the CPU from deformation
2Manufacturing precision
If the area of the upper surface of the CPU is smaller than the lower surface, then the chip design is optimized for electrical connection, but uneven force distribution occurs when contacted from both sides
Solution Approach 1:
The reinforcing piece serves as a mediator that distributes forces evenly across the larger lower surface of the CPU while allowing the upper surface to maintain its smaller area for optimized electrical connections. The reinforcing piece's contact surfaces are designed to match the geometry of the CPU, ensuring uniform force distribution without compromising electrical connection precision
Solution Approach 2:
The reinforcing piece provides localized support specifically at the areas where forces are applied to the circuit board, with its contact surfaces tailored to match the CPU's surface geometry. This local reinforcement approach maintains the asymmetric design of the CPU for electrical connections while providing the necessary mechanical support
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures even force distribution and strengthens the circuit board area, preventing deformation and cracking while effectively dissipating heat, ensuring the normal operation of the 5G AI box components.
Implementation Method 1
the first bump and the second bump comprise thermal conductive material
Data Source
AI summary
A fixing device includes a circuit board, a first cover, a reinforcing piece, and a double-layer chip. The circuit board has a first surface and a second surface opposite to each other. The first cover is disposed adjacent to the first surface and has a first bump which has a first abutting surface facing the first surface. The reinforcing piece is located on the first surface and adjacent to the first bump. The double-layer chip has an upper layer and a lower layer which are electrically connected. An upper surface of the upper layer and a lower surface of the lower layer are respectively located on opposite sides of the double-layer chip, and an area of the upper surface is smaller than an area of the lower surface. The lower layer of the double-layer chip and the second surface of the circuit board are electrically connected.