Double Layer Component Carrier Graphene Integration
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Solution Overview
Problem
The integration of two-dimensional materials like graphene into component carriers is challenging due to poor handling and compatibility with conventional manufacturing technologies, particularly in high-frequency and high-speed applications, where materials with low surface roughness and high electron mobility are required.
Innovation Solution
A double layer structure comprising an electrically conductive patterned layer and a further patterned layer made of a two-dimensional material, such as graphene, is used, where the patterned layers have the same pattern, allowing for synergistic effects and improved integration by using one layer as a mask for the other, facilitating manufacturing and enhancing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If graphene layers are deposited on another element to the desired location, then high electron mobility and low resistance are achieved, but handling and integration become extremely difficult
Solution Approach 1:
A transfer layer is introduced as an intermediary between the graphene layer and the target substrate. The graphene is first grown on a first substrate, then transferred to the second substrate through the transfer layer, which facilitates handling and integration while preserving graphene's electrical properties
Solution Approach 2:
The integration process is divided into separate stages: graphene growth on a dedicated first substrate, transfer layer application, and final placement on the target second substrate. This segmentation allows each step to be optimized independently, improving both handling and integration ease
2Ease of manufacture
If conventional PCB manufacturing technologies are used, then manufacturing compatibility is maintained, but performance improvement from two-dimensional materials is limited
Solution Approach 1:
The patent modifies conventional PCB manufacturing parameters by introducing specific transfer layers and adjusting deposition conditions to accommodate two-dimensional materials. This allows standard manufacturing equipment to be used while achieving superior electrical performance through the unique properties of materials like graphene
3Ease of manufacture
If a single layer structure is used, then manufacturing is simpler, but signal transmission performance at high frequencies is insufficient
Solution Approach 1:
The patent employs composite layer structures combining conventional conductive materials with two-dimensional materials like graphene. This composite approach leverages the high electron mobility of graphene at high frequencies while maintaining the structural simplicity and manufacturing advantages of conventional layers
Data Source
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AI summary
The present invention relates to a double layer structure for manufacturing a component carrier (1), wherein the double layer structure is composed of: an electrically conductive patterned layer structure (2); and a further patterned layer structure (3) made of a two-dimensional material. The patterned layer structure (2) and the further patterned layer structure (3) have at least partly the same pattern. The present invention also relates to a component carrier (1), wherein the component carrier (1) comprises: a stack comprising at least one electrically conductive layer structure (4) and/or at least one electrically insulating layer structure (5); and at least one double layer structure (2, 3) connected with the stack.