Double-Sealed Oscillator Mounting for Thermal Frequency Stability
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Solution Overview
Problem
Existing temperature compensated oscillators are susceptible to external temperature changes due to increased heat transfer between the resonator element and the integrated circuit, leading to instability in the oscillation frequency.
Innovation Solution
The oscillator employs a double seal structure with a base substrate featuring protruding portions to reduce heat transfer by using insulating bonding members, minimizing the bonding area between the second container and the base substrate, and optimizing the placement of these protrusions to reduce heat conduction and stress transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the integrated circuit is stacked on the base of the first container and the lid is fixed to the base of the second container to reduce temperature difference, then temperature uniformity is improved, but heat transfer to external environment increases and frequency stability deteriorates
Solution Approach 1:
The base substrate is segmented into multiple protruding portions instead of a continuous bonding surface. This segmentation reduces the total bonding area between the container and base substrate, thereby reducing heat transfer pathways to the external environment while maintaining structural support and temperature uniformity within the container.
Solution Approach 2:
The bonding structure transitions from uniform continuous bonding to localized discrete bonding at the protruding portions. This local quality change allows selective heat transfer control - maintaining thermal coupling where needed while isolating from external temperature variations through reduced bonding area.
2Measurement precision
If the entire surface of the lid is fixed to the base to reduce temperature difference, then temperature compensation effectiveness is improved, but external temperature influence increases and oscillation frequency stability worsens
Solution Approach 1:
The bonding interface is segmented into discrete protruding portions rather than a continuous surface. This reduces the total area through which external temperature can influence the container, while the protruding portions are positioned to maintain effective temperature compensation between the resonator element and integrated circuit.
Solution Approach 2:
The protruding portions act as intermediary bonding points that mediate between the need for thermal coupling (for temperature compensation) and the need for thermal isolation (to reduce external temperature influence). The reduced bonding area of protruding portions provides this intermediary function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances frequency stability by minimizing the impact of external temperature changes and reducing heat radiation, thereby maintaining consistent oscillation frequency.
Implementation Method 1
minimize heat transfer between the container and the base substrate
Data Source
AI summary
An oscillator includes a second container as a container in which a vibrator is accommodated, a base substrate on which the second container is mounted, three or more protruding portions provided on the base substrate at positions overlapping the second container in a plan view, and a bonding member configured to bond the second container and at least one of the protruding portions.