Double-Side Active Metal Brazing Substrate with Solder Containment
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Solution Overview
Problem
Traditional DBC ceramic substrates fail to meet high-temperature, high-power, and high-reliability packaging requirements due to solder overflow during sintering, leading to short circuits and reduced pattern accuracy.
Innovation Solution
A double-side active metal brazing substrate with retaining walls on both surfaces of a ceramic substrate, where the retaining wall thickness is less than the active metal layer thickness, preventing solder overflow and ensuring high-precision circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional DBC ceramic substrate is used, then manufacturing process is simple, but solder overflows during sintering causing short circuits and reduced pattern accuracy
Solution Approach 1:
The retaining walls are formed on the ceramic substrate before the active metal layer is applied. This preliminary structural preparation prevents solder overflow during subsequent sintering processes, eliminating the need for secondary etching and improving pattern accuracy without significantly complicating the overall manufacturing flow.
2Reliability
If retaining wall thickness is increased to prevent solder overflow, then solder containment improves, but bonding force between active metal layer and substrate decreases
Solution Approach 1:
The patent specifies that the retaining wall thickness is controlled to be less than the active metal layer thickness. This parameter optimization ensures that the retaining wall is sufficient to contain solder during sintering while maintaining adequate bonding force between the active metal layer and the ceramic substrate, resolving the contradiction between containment and bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents solder overflow, maintains bonding force, and enhances tensile strength, achieving high-precision patterned circuits without secondary etching, thus improving product quality.
Implementation Method 1
A copper layer is coated, and then bonded to the substrate by sintering process
Implementation Method 2
performing a brazing process to fix the first conductive metal layer to the ceramic substrate layer, and fix the second active metal layer to the ceramic substrate layer
Data Source
AI summary
A double-side active metal brazing substrate includes a ceramic substrate layer, first and second retaining walls, first and second active metal layers, and first and second conductive metal layer. The first active metal layer is disposed on a first surface of the ceramic substrate layer. The first active metal layer is surrounded by the first retaining wall and contacts the first retaining wall. The first conductive metal layer is disposed on the first active metal layer. The second active metal layer is disposed on a second surface of the ceramic substrate layer. The second active metal layer is surrounded by the second retaining wall and contacts the second retaining wall. The second conductive metal layer is disposed on the second active metal layer. The structural design of a thickness of the retaining wall being smaller than a thickness of the active metal layer can prevent a solder from overflowing.