Double-Sided Cooling for High-Density Power Electronic Assemblies

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Solution Overview

Problem

High-density integrated power electronic assemblies in electrified vehicles experience excessive operating temperatures due to inadequate heat dissipation, leading to potential thermal damage.

Innovation Solution

The integration of a cooling assembly with thermal spreaders that convey heat from both top and bottom surfaces of power electronic devices and gate drive electronics to a cooling structure, utilizing a heat pipe with vapor chambers and wicking structures to efficiently dissipate heat.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If power electronic devices are tightly packed in a high-density integrated assembly, then the volumetric footprint is reduced and parasitic inductance is reduced, but operating temperature increases to excessive levels

Engineering Contradiction:

Improvevolumetric footprintVSAvoidoperating temperature

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent merges the power electronic devices, gate drive electronics, and cooling structures into a single integrated assembly. The cooling structures are thermally coupled to both the power electronic devices and gate drive electronics, creating a unified thermal management system that handles heat from multiple heat-generating components simultaneously, thereby managing operating temperatures in high-density configurations

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces thermal spreaders as intermediary components between the heat-generating power electronic devices and the cooling structures. These thermal spreaders are in thermal contact with the power electronic devices and thermally couple heat to the cooling structures, effectively mediating heat transfer and enabling temperature control in the integrated assembly

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If power electronic devices are physically separated from gate drive devices and capacitors, then ease of manufacturing is improved, but the power electronic package occupies a larger volume and experiences larger parasitic inductance

Engineering Contradiction:

Improveease of manufactureVSAvoidpackage volume

Core Design Contradiction:

Ease of manufactureVSVolume of moving object

Solution Approach 1:

The patent combines previously separate components (power electronic devices, gate drive electronics, capacitors) into a single integrated power electronic assembly. This merging reduces the overall package volume and minimizes parasitic inductance by reducing the physical distance between components, while the integrated design maintains manufacturability through standardized assembly processes

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If high-density integrated power electronic assemblies are used, then parasitic inductance is reduced, but heat dissipation becomes inadequate leading to thermal damage

Engineering Contradiction:

Improveparasitic inductance reductionVSAvoidheat dissipation

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent implements cooling structures on both sides of the power electronic devices, utilizing the third dimension (z-axis) for heat dissipation. This double-sided cooling approach provides additional thermal pathways and increases the effective heat dissipation area, enabling adequate heat removal from high-density assemblies without compromising the compact design

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively maintains power electronic assemblies at ideal operating temperatures, reducing the risk of thermal damage and enhancing the reliability and efficiency of high-density power electronic assemblies in electrified vehicles.

Implementation Method 1

a coolant transitions from a liquid to a vapor in the first portion, a second portion positioned between the cooling assembly and the second edge of the power electronic device, where the coolant transitions from a vapor to a liquid in the second portion

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 2

a heat pipe with vapor chambers and wicking structures to efficiently dissipate heat

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Implementation Method 3

the coolant is wicked between the first portion and the second portion through the third portion

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Implementation Method 4

a cooling assembly offset from and thermally coupled to a second edge of the power electronic device, and a thermal spreader offset from and thermally coupled to a first edge of the power electronic device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11647612B2High-density integrated power electronic assembly including double-sided cooling structure

Publication Date: 2023.05.09 TOYOTA JIDOSHA KK

AI summary

An integrated power electronic assembly includes a power electronic device, a cooling assembly offset from and thermally coupled to a second edge of the power electronic device, and a thermal spreader offset from and thermally coupled to a first edge of the power electronic device. The first edge of the power electronic device is opposite the second edge of the power electronic device, and the thermal spreader is thermally coupled to the cooling assembly.