Double-Sided Chip-On-Film FPC for Compact Display Connection
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Solution Overview
Problem
Display products with high resolution or large size face challenges in achieving compact layout, lightness, and thinness due to the large width of flexible printed circuits required for signal transmission, which also increases the risk of deformation and reduces bonding yield.
Innovation Solution
A connection structure that uses a flexible printed circuit with double-sided bonding via first and second chip-on-films, where the chip-on-films are coupled to opposite surfaces of the flexible printed circuit, reducing the width and space occupied by the circuit, facilitating compact design and improving bonding yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the width of flexible printed circuit is increased to meet high resolution or large size display requirements, then signal transmission capability is improved, but device compactness and thinness deteriorate
Solution Approach 1:
The patent transitions from single-sided bonding to double-sided bonding of chip-on-films on the flexible printed circuit. By utilizing both surfaces of the FPC, the bonding structure extends into the thickness dimension, effectively reducing the planar width requirement while maintaining signal transmission capability.
2Quantity of substance
If the width of flexible printed circuit is increased for large size display, then signal transmission is improved, but device weight increases
Solution Approach 1:
By configuring chip-on-films on both sides of the flexible printed circuit, the patent reduces the planar dimensions of the FPC. This dimensional transition from width-based to thickness-based configuration directly reduces the overall material quantity and device weight.
3Quantity of substance
If the width of flexible printed circuit is increased, then signal transmission capability is improved, but bonding yield deteriorates due to increased deformation risk
Solution Approach 1:
The double-sided bonding configuration distributes bonding points across both surfaces of the flexible printed circuit. This spatial distribution in the thickness dimension reduces the span and deformation risk of the FPC, thereby improving bonding yield and reliability.
Solution Approach 2:
By dividing bonding operations into two separate sides of the flexible printed circuit, the patent segments the bonding process. This segmentation allows for better control of each bonding operation independently, reducing the overall deformation risk and improving bonding yield.
Data Source
AI summary
A connection structure configured to connect a display panel and a circuit board, includes a flexible printed circuit, a first chip-on-film, and a second chip-on-film. The first chip-on-film and the second chip-on-film are coupled to one end of the flexible printed circuit. The first chip-on-film and the second chip-on-film are coupled to two surfaces of the flexible printed circuit that are opposite in a thickness direction of the flexible printed circuit.