Double-Sided Circuit Board With Laser Microvias for Waterproof Routing

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Solution Overview

Problem

Conventional hole-processing methods for circuit boards, such as mechanical drilling and injection molding, are unable to create small-sized holes, making them visible and non-waterproof, and require complex mold manufacturing for precise positioning and sizing, which limits flexibility in hole placement and size adjustment.

Innovation Solution

A method using a pulse laser to create micro conductive vias in non-conductive substrates, allowing for the formation of double-sided conductive circuits with invisible and waterproof holes, enabling precise control over hole size and position without the need for pre-manufactured molds.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If mechanical drilling is used to create holes in circuit boards, then holes can be created through the substrate, but the holes are large and visible, and the circuit board cannot be waterproof

Engineering Contradiction:

Improvehole sizeVSAvoidwaterproof capability

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent replaces mechanical drilling with laser drilling technology. The laser beam creates micro-holes through the circuit board substrate without mechanical contact, achieving hole diameters of less than 0.1mm that are invisible to the naked eye and provide waterproof sealing capability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the drilling method from mechanical to optical (laser), and controls the hole diameter parameter to be less than 0.1mm. This parameter change enables the holes to be both small enough to be invisible and small enough to provide effective waterproof sealing.

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If injection molding is used to create holes in circuit boards, then holes can be created with precise positioning, but the mold manufacturing process is complex and time-consuming, and position/size changes are difficult

Engineering Contradiction:

Improvehole position and size controlVSAvoidmold manufacturing complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical injection molding process with laser drilling. The laser system can be programmatically controlled to create holes at any position and size without requiring physical mold manufacturing, enabling rapid design changes and iterations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces flexibility and adaptability to the hole creation process by using programmable laser control. Hole positions, sizes, and patterns can be dynamically adjusted through software programming without changing physical molds, enabling rapid prototyping and design modifications.

Inventive Principle:

Principle #15Dynamics

3Productivity

If mechanical drilling is used, then holes can be created quickly, but the drilling tool limitations prevent creation of small sized holes

Engineering Contradiction:

Improvehole creation speedVSAvoidhole size

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces mechanical drilling tools with a laser beam system. The laser can quickly create micro-holes with diameters less than 0.1mm through optical ablation of the substrate material, combining high speed with high precision that mechanical tools cannot achieve.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the creation of smaller, invisible, and waterproof holes with flexible positioning and sizing, improving the quality and adaptability of circuit boards by using a pulse laser to form conductive circuits within non-conductive substrates.

Implementation Method 1

utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

forming a metallic base layer upon at least one surface and inside the through hole of the non-conductive substrate

Methodology Applied

Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Data Source

PatentUS11134574B2Double-sided circuit board and method for preparing the same

Publication Date: 2021.09.28 TAIWAN GREEN POINT ENTERPRISE

AI summary

A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region.