Double-Sided Multichip Packaging With Through-Package Interconnects
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Solution Overview
Problem
Existing multichip packaging technologies face challenges in efficiently integrating semiconductor devices with varying footprints and thicknesses, often requiring complex substrate modifications and limiting flexibility in die placement and interconnect configurations.
Innovation Solution
The use of polymeric materials to form encapsulating molding and redistribution layers, along with through-package interconnects, allows for the integration of semiconductor devices with diverse sizes and thicknesses, enabling flexible die arrangements and efficient electrical connections through multiple layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional multichip packaging technologies are used, then semiconductor devices can be integrated within a package, but complex substrate modifications are required and flexibility in die placement is limited
Solution Approach 1:
The package substrate is divided into multiple independent layers including a support substrate, molding material layers, and redistribution layers. Each layer can be independently fabricated and modified, allowing flexible die placement without requiring complex modifications to the entire substrate structure. The molding material is segmented into multiple layers that can be separately applied and cured.
Solution Approach 2:
The patent transitions from planar 2D substrate modifications to 3D volumetric integration by stacking multiple molding material layers and redistribution layers vertically. Dies can be placed at different heights and positions within the three-dimensional package structure, providing flexibility in die placement without requiring complex modifications to any single substrate layer.
2Volume of moving object
If multiple devices are assembled within one package, then volume required for components is reduced, but integration of devices with varying footprints and thicknesses becomes challenging
Solution Approach 1:
Multiple electronic components with different footprints and thicknesses are nested within the volumetric package structure formed by stacked molding material layers. Larger components can be positioned at lower layers while smaller or thinner components are placed in upper layers or within available spaces, maximizing space utilization and accommodating device diversity within a compact volume.
Solution Approach 2:
The molding material layers are applied with varying thicknesses and properties at different locations to accommodate components with varying footprints and thicknesses. The redistribution layers are selectively formed at specific positions to provide localized electrical interconnections, allowing each component to be integrated according to its specific requirements while maintaining overall package compactness.
3Reliability
If complex substrate modifications are performed, then electrical interconnections between devices can be established, but manufacturing process complexity increases
Solution Approach 1:
Conductive interconnect structures are preliminarily formed within the molding material layers before the final package assembly is completed. Through-holes and vias are created and filled with conductive material in advance, establishing reliable electrical interconnection paths between devices. This preliminary formation of interconnections simplifies subsequent assembly steps and reduces manufacturing complexity.
Solution Approach 2:
Redistribution layers serve as intermediary structures that facilitate electrical interconnections between devices with different interconnect configurations. These intermediate conductive layers are formed within the molding material and provide flexible routing options, simplifying the connection process between devices without requiring complex direct modifications to each device's substrate.
Data Source
AI summary
An electronic device package and method of fabricating such a package includes a first and second components encapsulated in a volume of molding material. A surface of the first component is bonded to a surface of the second component. Upper and lower sets of redistribution lowers that include, respectively, first and second sets of conductive interconnects are formed on opposite sides of the molding material. A through-package interconnect passes through the volume of molding material and has ends that terminate, respectively, within the upper set of redistribution layers and within the lower set of redistribution layers.