Double-Sided Package Edge Metal Features for Inspectable Solder Fillets
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Solution Overview
Problem
The use of double-sided packages in some environments is not feasible due to interior electrical connection requirements, limiting their application in small form factor devices.
Innovation Solution
Incorporating metal edge features, such as copper posts, during the formation of double-sided laminates, which are sawn through during singulation to provide wettable flanks or structural integrity, enabling flexible use of double-sided packages in various environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If double-sided packages are used to increase processing power in small areas, then device functionality is improved, but interior electrical connection requirements become complex and limit applicability
Solution Approach 1:
The patent introduces metal edge features that extend vertically from the substrate surface, utilizing the third dimension (height) to provide electrical connections. This eliminates the need for complex interior electrical connections within the substrate plane, as connections can be made from the edge of the package rather than through internal traces and vias.
Solution Approach 2:
The metal edge features are formed during the substrate fabrication process before the package is completed. This preliminary formation of metal structures at the edges allows for simplified subsequent assembly and connection processes, avoiding the need for complex post-fabrication electrical interconnection work.
2Ease of manufacture
If metal edge features are added to provide wettable flanks for solder fillets, then manufacturing flexibility is improved, but device structure becomes more complex
Solution Approach 1:
The patent combines multiple functions into the metal edge features: they provide structural support, create wettable flanks for soldering, and enable electrical connections. By merging these functions into a single integrated feature formed during substrate fabrication, the overall manufacturing process is simplified despite the added functionality.
Solution Approach 2:
The metal edge features serve multiple purposes simultaneously: they act as structural reinforcement, provide surfaces for solder fillet formation and inspection, and serve as electrical connection points. This multi-functionality reduces the need for separate components and simplifies the overall package design.
Data Source
AI summary
Metal edge features on double-sided packages are disclosed. In one aspect, metal such as copper posts may be positioned in a double-sided laminate extending between packages during formation and prior to singulation. Then, during singulation, the post is sawn through. The posts may be used to provide wettable flanks on the side of the package to allow for an inspectable solder fillet. Alternatively, the posts may be used for greater structural integrity. By providing these edge-accessible metal features, designers are able to use double-sided packages with correspondingly small footprints in more environments, allowing for more flexibility in product design.