Double-Sided Power Module Structure for Higher Power Density
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Solution Overview
Problem
Existing power modules have limited power output and require multiple modules in series, increasing space requirements and heat dissipation issues.
Innovation Solution
A double-sided power device with support members connecting two power modules, enhancing electrical connection and heat dissipation through a structural design that includes conductive layers and encapsulant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple power modules are connected in series to increase power output, then the power output capability is improved, but the space required for installation increases
Solution Approach 1:
The patent transitions from a single-sided power module design to a double-sided design, utilizing both sides of the circuit substrate to mount power chips. This dimensional change allows power output to be doubled without proportionally increasing the installation footprint, as the second set of power chips is mounted on the opposite side of the same substrate area.
Solution Approach 2:
The patent employs a stacked configuration where the second power module is positioned adjacent to and integrated with the first power module on the same substrate. The support members extend vertically to connect corresponding conductive layers between the two sides, creating a nested three-dimensional structure that maximizes space utilization.
2Power
If multiple power modules are connected in series to increase power output, then the power output capability is improved, but the device complexity increases
Solution Approach 1:
The patent merges two power modules into a single integrated double-sided power device package. The first and second power modules share common substrate structures, support members, and encapsulation, reducing the overall device complexity compared to maintaining them as separate modules. The support members serve dual purposes by providing both mechanical support and electrical connections between the two sides.
Solution Approach 2:
The support members perform multiple functions simultaneously: they provide mechanical support to maintain the structural integrity of the double-sided configuration, establish electrical connections between corresponding conductive layers on opposite sides, and facilitate heat dissipation pathways. This multi-functionality reduces the need for additional separate components.
3Power
If high-power modules are designed to increase power output, then the power capability is improved, but the heat dissipation capability becomes insufficient
Solution Approach 1:
The patent utilizes the vertical dimension by extending support members through the substrate thickness to create heat dissipation pathways from the first side to the second side. This three-dimensional heat transfer approach complements traditional planar heat dissipation methods, providing additional thermal management capacity for high-power operation.
Solution Approach 2:
The support members act as thermal intermediaries, conducting heat away from the power chips on both sides of the substrate. By establishing direct thermal conduction pathways through the support members to external heat sinks or cooling structures, the patent enhances overall heat dissipation capability without compromising power output.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Increases power output per unit area, improves structural strength, and enhances heat dissipation capabilities.
Implementation Method 1
Two ends of the first support member are electrically connected to the first conductive layer and the third conductive layer, respectively, and two ends of the second support member are electrically connected to the second conductive layer and the fourth conductive layer, respectively
Implementation Method 2
The encapsulant is filled in the packaging space
Data Source
AI summary
A double-sided power device and a method for manufacturing the double-sided power device are provided. The double-sided power device includes a first power module, a second power module, two support members, and an encapsulant. The first power module includes a first power chip. The second power module includes a second power chip. The first power module is opposite to the second power module, and a packaging space is defined between the first power module and the second power module. The two support members are located in the packaging space to be connected to the first power module and the second power module, respectively. The encapsulant is filled in the packaging space.