Double-Sided Sputtering Target Rotation Mechanism

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Solution Overview

Problem

Current physical vapor deposition (PVD) processes require transferring workpieces between different chambers to deposit disparate materials, which can affect material properties due to high temperature processing and increase manufacturing time, leading to inefficiencies and potential particle contamination.

Innovation Solution

A double-sided sputtering target system is introduced, where two targets with different materials (e.g., TiN and AlCu) are coupled to a rotation mechanism, allowing in-situ deposition within a single chamber without the need for chamber transfers, by rotating the targets between deposition phases.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If workpiece is transferred between different process chambers to deposit disparate materials, then material deposition capability is improved, but manufacturing time increases and particle contamination risk increases

Engineering Contradiction:

Improvematerial deposition capabilityVSAvoidmanufacturing time

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

The patent combines multiple sputtering targets with different materials (e.g., AlCu and TiN) into a single physical vapor deposition chamber. The system uses a rotation mechanism to position different targets in front of the workpiece during the same deposition process, eliminating the need to transfer the workpiece between multiple chambers and thereby reducing manufacturing time while maintaining the ability to deposit disparate materials.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The deposition chamber is designed with multi-functionality to handle multiple material deposition tasks. By equipping the chamber with multiple sputtering targets and a rotation mechanism, the same chamber can deposit different materials (AlCu, TiN, etc.) without requiring separate dedicated chambers for each material type, thus reducing overall system complexity and processing time.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If workpiece is transferred between different process chambers to deposit disparate materials, then material deposition capability is improved, but particle contamination increases

Engineering Contradiction:

Improvematerial deposition capabilityVSAvoidparticle contamination

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

3Loss of time

If multiple sputtering targets are used in a single chamber with rotation mechanism, then manufacturing time is reduced, but device complexity increases

Engineering Contradiction:

Improvemanufacturing timeVSAvoiddevice complexity

Core Design Contradiction:

Loss of timeVSDevice complexity

Solution Approach 1:

The patent introduces a rotation mechanism that dynamically positions different sputtering targets in front of the workpiece during the deposition process. This dynamic capability allows the system to switch between different materials without physical reconfiguration or chamber transfer, reducing manufacturing time while managing complexity through automated motion control rather than multiple static chambers.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing time, prevents particle contamination, and improves product yield by enabling simultaneous deposition of multiple materials in a single chamber, potentially reducing cycle time by up to 80% compared to traditional methods.

Implementation Method 1

Current physical vapor deposition (PVD) processes uses targets as the source of deposited materials

Methodology Applied

Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Implementation Method 2

A double-sided sputtering target system is introduced, where two targets with different materials

Methodology Applied

Scientific EffectSputtering: Sputtering

Data Source

PatentUS11649543B2Target structure of physical vapor deposition

Publication Date: 2023.05.16 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A sputtering target structure includes a body having a first side and an opposing second side. A first sputtering target is coupled to the first side of the body. The first sputtering target includes a first material. A second sputtering target is coupled to the second side of the body. The second sputtering target includes a second material. A rotation mechanism is coupled to the body and is configured to allow rotation of the body from a first orientation to a second orientation.