Double-Sided Thermal Module for Semiconductor Package Heat Dissipation
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in efficiently dissipating heat from voltage regulator modules (VRMs) due to their separation from circuit blocks, leading to potential overheating and failure, while also requiring efficient thermal management for high-performance semiconductor devices.
Innovation Solution
A double-sided thermal module with a 'sandwich' configuration, comprising a top and bottom plate with integrated heat pipes and a liquid cooling system, provides multiple heat dissipation paths from both sides of the semiconductor device, positioning VRMs and ICs for optimal thermal coupling and heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If voltage regulator modules are separated from circuit blocks, then electrical functionality is improved, but thermal management deteriorates leading to overheating
Solution Approach 1:
The patent transitions from planar thermal management to three-dimensional thermal management by implementing heat dissipation paths that extend through the vertical dimension of the package. Multiple heat dissipation paths are established from different sides and layers of the package, allowing heat to be conducted away from VRMs in multiple spatial directions simultaneously, thereby resolving the thermal management issue while maintaining electrical separation.
Solution Approach 2:
The thermal management system is segmented into multiple independent heat dissipation paths rather than relying on a single cooling mechanism. Each heat dissipation path is independently configured to conduct heat from specific heat-generating components, allowing optimized thermal management for different regions of the package while maintaining the electrical functionality improvements from component separation.
2Ease of manufacture
If semiconductor devices are scaled down, then manufacturing cost is reduced, but manufacturing complexity increases
Solution Approach 1:
The package structure is designed with multi-functional elements that serve both electrical and thermal management purposes. The substrate and interconnect structures are configured to simultaneously provide electrical connectivity and thermal conduction pathways, reducing the need for separate dedicated cooling components and thereby simplifying the overall manufacturing process despite device scaling.
3Temperature
If cooling techniques are applied, then thermal management is improved, but device complexity increases
Solution Approach 1:
The patent merges thermal management functions into the existing package structure rather than adding separate cooling systems. Heat dissipation paths are integrated into the substrate and interconnect structures that already exist for electrical functionality, combining thermal and electrical management into a unified package design that avoids increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from both VRMs and ICs, reducing the risk of overheating and ensuring reliable operation by enhancing thermal management, potentially eliminating the need for additional cooling components like fans or heatsinks.
Implementation Method 1
at least one heat pipe extending from the upper plate to the lower plate
Implementation Method 2
liquid cooling system
Implementation Method 3
provides multiple heat dissipation paths
Data Source
AI summary
A device package provides for thermal considerations of a semiconductor die(s) through providing a thermal module. A substrate including an IC die disposed on the substrate is positioned between an upper plate and a lower plate of the thermal module. Heat pipes connect the upper plate and the lower plate. The thermal module allows for heat dissipation paths from the lower as well as upper plate. In some implementations, a liquid cooling plate is positioned between the substrate and the upper plate of the thermal module.