Double Substrate LED Array with Metal Pillar Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED packaging methods are costly and time-consuming, particularly for large LED packages with multiple LEDs, and they face reliability issues due to high voltage breakdown risks, especially in planar interconnect structures.
Innovation Solution
A method for fabricating a light-emitting structure involving epitaxy semiconductor layers grown on a substrate, followed by patterning and metal pillar formation for interconnection, and bonding multiple LEDs into a compact vertical array using a double-substrate structure with metal pillars and a transparent cap, which reduces packaging form factor and enhances reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional wire bonding is used for LED packaging, then electrical connection is achieved, but package height and volume increase
Solution Approach 1:
The patent transitions from planar wire bonding to vertical pillar-based interconnection. Metal pillars extend vertically through the package substrate, enabling electrical connection in the vertical dimension rather than requiring horizontal wire routing. This dimensional change eliminates the need for wire bonding and reduces overall package volume.
Solution Approach 2:
The patent extracts and eliminates the wire bonding component from the package structure. By using integrated metal pillars formed directly in the substrate, the separate wire bonding step and associated components are removed, simplifying the overall package architecture and reducing volume.
2Adaptability or versatility
If multiple LED dies are individually attached to packaging substrate, then LED array is formed, but assembly time and cost increase
Solution Approach 1:
The patent performs preliminary actions by pre-forming metal interconnection pillars and routing structures within the package substrate before LED die attachment. This pre-configured interconnection network enables simultaneous or streamlined assembly of multiple LED dies, eliminating sequential wire bonding operations for each die and significantly reducing assembly time.
Solution Approach 2:
The patent merges multiple interconnection functions into a single integrated substrate structure. The package substrate incorporates both mechanical support and electrical interconnection pathways for multiple LED dies simultaneously, combining functions that would otherwise require separate components and assembly steps.
3Ease of manufacture
If planar interconnect structure is used in high voltage applications, then manufacturing is simplified, but high voltage breakdown risk increases
Solution Approach 1:
The patent addresses high voltage breakdown risk by transitioning from planar interconnect geometry to vertical pillar-based interconnection. The vertical metal pillars increase the electrical breakdown path length and provide better voltage distribution, enhancing high voltage reliability while maintaining manufacturing simplicity through integrated substrate formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, improves LED quality, and prevents high voltage breakdown by enabling efficient electrical and optical performance with shorter interconnection distances and a compact form factor, while integrating phosphor for wavelength shifting.
Implementation Method 1
growing epitaxy semiconductor layers on a first substrate
Implementation Method 2
metal pillars...configured to electrically connect the plurality of light-emitting diodes
Implementation Method 3
integrating phosphor for wavelength shifting
Data Source
AI summary
The present disclosure provides one embodiment of a light-emitting structure. The light-emitting structure includes a carrier substrate having first metal features; a transparent substrate having second metal features; a plurality of light-emitting diodes (LEDs) bonded with the carrier substrate and the transparent substrate, sandwiched between the carrier substrate and the transparent substrate; and metal pillars bonded to the carrier substrate and the transparent substrate, each of the metal pillars being disposed between adjacent two of the plurality of LEDs, wherein the first metal features, the second metal features and the metal pillars are configured to electrically connect the plurality of LEDs.