Downconverter Layer Transfer for Precise Micro-LED Phosphor Alignment
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Solution Overview
Problem
Current methods for attaching phosphors to LED dies, such as the pick-and-place approach, are time-consuming and prone to accuracy issues, leading to inefficiencies in manufacturing high-resolution light emitting devices like micro-LEDs.
Innovation Solution
A downconverter layer transfer device with a siliconized layer and a heat-curable adhesive material is used, allowing for the simultaneous transfer and adherence of downconverter materials to LED arrays, ensuring precise alignment and strong bonding without the need for separate bonding layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pick-and-place approach is used to attach phosphors to LED dies, then individual phosphor placement is achieved, but manufacturing time increases and alignment accuracy decreases
Solution Approach 1:
The patent combines multiple phosphors onto a single carrier substrate to form a phosphor array, which is then transferred to multiple LED dies simultaneously. This merging approach eliminates the need for individual pick-and-place operations, thereby improving both alignment accuracy and manufacturing throughput.
Solution Approach 2:
The phosphors are pre-arranged and fixed onto the carrier substrate before the transfer process. This preliminary arrangement ensures precise alignment positions are predetermined, allowing simultaneous transfer to multiple LED dies without requiring real-time alignment adjustments during the attachment process.
2Strength
If separate bonding layers are used to attach phosphors to LED dies, then strong bonding is achieved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent merges the bonding layer function directly into the carrier substrate by applying the bonding layer to the carrier before attaching the phosphors. This integration eliminates the need for separate bonding layers between the phosphors and LED dies, reducing device complexity while maintaining strong bonding through the unified structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient and accurate attachment of downconverter materials to LED dies, improving manufacturing throughput and reducing alignment errors, resulting in high-performance light emitting devices with uniform light emission.
Implementation Method 1
The adhesive may be a heat-curable adhesive material that, before curing, is solid and non-adhesive at a first temperature, and is adhesive at an elevated temperature above the first temperature
Implementation Method 2
a downconverter layer transfer device having a release liner and a downconverter layer comprising separate downconverter pixels
Data Source
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AI summary
A downconverter layer transfer device, and methods of making and using the downconverter layer transfer device, are disclosed. A downconverter layer transfer device includes a release liner and a downconverter layer disposed on the release liner, the downconverter layer including a downconverter material dispersed throughout an adhesive, the downconverter layer being solid and non-adhesive at a first temperature, and adhesive at an elevated temperature above the first temperature.