DRAM Bit Line Selector Layout for Lower Voltage Drop and Noise

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Solution Overview

Problem

The design of the bit line select unit in Dynamic Random Access Memory (DRAM) faces challenges such as voltage drop, time delay, coupling effect, and noise effect due to misaligned active regions and conductive contacts, leading to poor performance and manufacturing difficulties.

Innovation Solution

A semiconductor structure with a bit line select unit featuring a symmetrical 'H' shape arrangement of gates and connection lines, ensuring straight bit lines and balanced conductive contacts, reducing coupling and noise effects while simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional bit line select unit design is used, then device functionality is achieved, but voltage drop and time delay occur due to misaligned active regions and conductive contacts

Engineering Contradiction:
Improvesignal transmission qualityVSAvoidvoltage drop
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent employs asymmetric layout adjustment where active regions are intentionally misaligned relative to each other, and conductive contacts are positioned asymmetrically to connect bit lines. This asymmetric design optimizes the electrical connection paths to reduce voltage drop and time delay while maintaining proper transistor functionality.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent introduces a third dimension (vertical stacking) by forming conductive contacts that extend through multiple layers to connect misaligned active regions. This dimensional approach allows optimization of electrical paths without compromising the planar layout, reducing both voltage drop and time delay effects.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If traditional bit line select unit design is used, then device functionality is achieved, but coupling effect and noise effect increase due to misaligned structures

Engineering Contradiction:
Improvesignal integrityVSAvoidcoupling effect and noise effect
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The asymmetric positioning of active regions and conductive contacts creates optimized electrical isolation between adjacent bit lines. By carefully designing the asymmetric layout, the patent reduces capacitive coupling and noise interference between neighboring signal lines while maintaining functional connectivity.

Inventive Principle:
Principle #4Asymmetry

3Adaptability or versatility

If misaligned active regions and conductive contacts are used, then device functionality is achieved, but manufacturing precision and consistency become difficult to control

Engineering Contradiction:
Improvedesign flexibilityVSAvoidalignment precision
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent incorporates alignment marks and reference structures in the preliminary design stage that guide the formation of misaligned active regions and conductive contacts. These pre-planned alignment features enable precise control of the intended misalignment, ensuring manufacturing consistency while achieving the desired electrical performance.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent systematically varies geometric parameters such as active region dimensions, contact positions, and layer offsets to optimize both the electrical performance and manufacturability. By carefully controlling these parameters within specific ranges, the design achieves robust performance across manufacturing variations.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS12575092B2Semiconductor structure and memory
Publication Date: 2026.03.10 CHANGXIN MEMORY TECH INC
  • US12575092B2 patent drawing
  • US12575092B2 patent drawing
  • US12575092B2 patent drawing

AI summary

A semiconductor structure and a memory are provided. The semiconductor structure includes multiple active regions, a column selector and multiple bit lines. The column selector includes a first gate, a second gate, a third gate, a fourth gate and a connection line. The first gate and the second gate intersect at a first node, the third gate and the fourth gate intersect at the second node, and the connection line connects the first node and the second node. Each of the multiple bit lines includes a first portion, a second portion and a connection portion. Each of the multiple bit lines is connected to a respective one of the multiple active regions, the active regions connected to different bit lines among the multiple bit lines are different.