Dressing Board for Semiconductor Blade Refurbishment
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Solution Overview
Problem
Existing semiconductor cutting and trimming tools face issues with worn cutting surfaces, particularly uneven wear and difficulty in repairing complex edge geometries, leading to inefficient dicing and shaping processes and frequent disposal of blades.
Innovation Solution
The use of dressing boards with variously shaped working surfaces, such as flat, sloped, concave, and convex, to refurbish and repair cutting blades, allowing for precise reshaping and extension of blade life using softer, less damaging materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If hard, durable materials are used for cutting blades, then blade durability is improved, but substrate damage increases and manufacturing precision decreases
Solution Approach 1:
The patent changes the material parameter from hard/durable to soft/ductile, allowing the blade to be replaced and re-sharpened rather than discarded. This parameter change resolves the contradiction by enabling precise cutting surfaces to be restored through dressing board treatment, eliminating the need for hard materials that cause substrate damage.
Solution Approach 2:
The patent implements a system where soft blades that become dull are not discarded but are recovered through the dressing board sharpening process. The blade is pressed against the dressing board to restore its cutting edge, allowing continuous reuse and eliminating the need for hard, disposable blades.
2Duration of action of stationary object
If hard, durable materials are used for cutting blades, then blade durability is improved, but substrate damage increases
Solution Approach 1:
The patent changes the material parameter from hard/durable to soft/ductile, allowing the blade to be replaced and re-sharpened rather than discarded. This parameter change resolves the contradiction by enabling precise cutting surfaces to be restored through dressing board treatment, eliminating the need for hard materials that cause substrate damage.
Solution Approach 2:
The patent adopts soft, less durable blades that can be easily replaced and sharpened, rather than investing in hard, durable blades. This approach accepts shorter blade life but eliminates substrate damage, and the cost is offset by the ability to regenerate the cutting edge through the dressing board system.
3Manufacturing precision
If frequent blade disposal is required, then cutting precision is maintained, but productivity decreases and waste increases
Solution Approach 1:
The patent implements a system where soft blades that become dull are not discarded but are recovered through the dressing board sharpening process. The blade is pressed against the dressing board to restore its cutting edge, allowing continuous reuse and eliminating the need for frequent blade replacement.
Solution Approach 2:
The patent enables continuous useful action by allowing the same blade to be reused multiple times through the dressing board sharpening process. Instead of discarding dull blades and starting fresh, the system continuously restores the cutting edge, maintaining productivity and reducing waste.
4Manufacturing precision
If frequent blade disposal is required, then cutting precision is maintained, but waste increases
Solution Approach 1:
The patent implements a system where soft blades that become dull are not discarded but are recovered through the dressing board sharpening process. The blade is pressed against the dressing board to restore its cutting edge, allowing continuous reuse and eliminating the need for frequent blade replacement.
Solution Approach 2:
The patent enables continuous useful action by allowing the same blade to be reused multiple times through the dressing board sharpening process. Instead of discarding dull blades and starting fresh, the system continuously restores the cutting edge, maintaining productivity and reducing waste.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise repair and refurbishment of cutting surfaces, extending blade life, reducing material waste, and allowing the use of softer, less damaging materials for semiconductor processing, improving dicing and shaping efficiency.
Implementation Method 1
dressing boards with variously shaped working surfaces, such as flat, sloped, concave, and convex, to refurbish and repair cutting blades
Data Source
AI summary
A dressing board for sharpening and/or shaping blades for manufacture of semiconductor devices can include a working surface configured to sharpen and/or shape a cutting surface of a dicing or edging blade for manufacture of a semiconductor device. The working surface can be configured to contact the cutting surface of the blade when sharpening or shaping the cutting surface. The dressing board can include a support substrate configured to support the working surface with respect to a floor of an enclosure in which the dressing board is positioned. In some embodiments, the working surface includes a first portion that is not parallel to the floor.