Drive Backplane Layout for Uniform Via Formation
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Solution Overview
Problem
Existing drive backplanes for miniature/micro light-emitting diode displays face challenges in achieving uniform thickness of flat layers, leading to poor via hole formation and increased manufacturing costs due to the need for multiple patterning processes, which affects the electrical connection between conductive layers and increases resistance.
Innovation Solution
A drive backplane design with a first flat layer in regions other than the conductive layer pattern, ensuring good thickness uniformity, and the use of inorganic layers and anti-oxidation conductive layers to improve airtightness and prevent oxidation, along with a manufacturing method that simplifies the patterning process by using the same mask for both conductive and flat layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple patterning processes are used to form via holes in flat layers, then via hole formation quality improves, but manufacturing complexity and costs increase
Solution Approach 1:
The flat layer pattern is formed in advance using the same mask as the conductive layer, creating a preliminary structure that guides subsequent via hole formation. This preliminary action ensures that the via holes are automatically aligned with the conductive layer patterns, eliminating the need for additional patterning steps while maintaining high via hole formation quality
Solution Approach 2:
The patent combines the patterning of the flat layer and conductive layer into a single mask step. By forming both patterns simultaneously using the same mask, the process reduces the number of separate patterning operations required, thereby simplifying manufacturing while ensuring precise alignment for via hole formation
2Reliability
If flat layer thickness is increased to ensure coverage, then coverage improves, but thickness uniformity deteriorates
Solution Approach 1:
The flat layer is designed with spatially varying thickness: thicker regions are positioned where coverage is critical (over conductive layer gaps), while thinner regions are used where coverage is already sufficient. This local quality approach ensures adequate coverage throughout the structure while maintaining overall thickness uniformity and avoiding the need for excessive thickness everywhere
Solution Approach 2:
The patent optimizes the flat layer thickness parameter within a specific range (less than or equal to the conductive layer thickness in certain regions). By carefully selecting and controlling the thickness parameter rather than simply increasing it, the design achieves both sufficient coverage and good thickness uniformity, resolving the contradiction between these two requirements
3Reliability
If conductive layer thickness is increased to reduce resistance, then electrical conductivity improves, but manufacturing complexity increases
Solution Approach 1:
The patent employs composite material structures where the conductive layer is combined with the flat layer and via hole structures to create an integrated conductive system. This composite approach achieves the desired electrical conductivity through the combined effect of multiple layers and pathways rather than relying solely on increasing the thickness of a single conductive layer, thereby avoiding additional manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved thickness uniformity of flat layers, ensures effective electrical connection, reduces manufacturing costs, and enhances the airtightness and durability of the drive backplane by preventing oxidation, thereby decreasing drive resistance and improving overall display performance.
Implementation Method 1
forming an electroplating seed layer on the base substrate; forming the pattern of the first conductive layer by adopting an electroplating process
Implementation Method 2
forming a photoresist layer on the electroplating seed layer, and patterning the photoresist layer; forming the first flat layer by adopting a photoresist material with the same photosensitivity as the photoresist layer
Data Source
AI summary
The present disclosure discloses a drive backplane, a manufacturing method thereof and a display panel. The drive backplane includes: a base substrate; a first conductive layer, located on the base substrate; a first flat layer, located in a region, other than a pattern of the first conductive layer, on the base substrate; a second flat layer, located on a side, facing away from the base substrate, of the first conductive layer and the first flat layer, where the second flat layer includes a plurality of first via holes; and a second conductive layer, located on a side, facing away from the base substrate, of the second flat layer, where a pattern of the second conductive layer is electrically connected with the pattern of the first conductive layer through the first via holes.