Driving Chip Bump Structure for Flexible Display Bonding
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Solution Overview
Problem
The challenge in manufacturing high-resolution flexible display devices is the deformation of flexible display panels due to high bonding pressure during the compression-bonding of driving chips, which can lead to defects such as open circuits or short circuits, especially when using Chip-On-Film (COF) bonding, as the existing methods are costly and limited by thick bonding lines.
Innovation Solution
The solution involves a driving chip with connecting bumps and supporting bumps arranged in specific patterns to provide structural support during compression-bonding, ensuring that the flexible display panel is not deformed, thereby maintaining the integrity of metal wirings. The supporting bumps are designed to be thinner than the connecting bumps and strategically placed between them to distribute pressure evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the driving chip is compression-bonded to the flexible display panel, then the electrical connection is achieved, but the flexible display panel is deformed and metal wirings are broken due to high bonding pressure
Solution Approach 1:
The bonding structure is segmented into connecting bumps for electrical connection and supporting bumps for mechanical support. The connecting bumps are arranged in arrays to provide electrical pathways, while the supporting bumps are positioned between and around the connecting bumps to distribute bonding pressure and prevent panel deformation.
Solution Approach 2:
Different regions of the driving chip have different bump densities and types. The connecting bumps have larger size for reliable electrical connection, while the supporting bumps have smaller size and are strategically positioned to provide local mechanical support where needed to prevent wiring breakage during compression bonding.
2Ease of manufacture
If COF bonding is used, then the manufacturing process is established, but the cost is high and resolution is limited due to thick bonding lines
Solution Approach 1:
The patent replaces the traditional COF mechanical bonding system with a direct compression-bonding system using bump structures. This substitution eliminates the need for thick COF bonding lines and associated complex manufacturing processes, enabling higher resolution while reducing manufacturing complexity through standardized bump array patterns.
Data Source
AI summary
The present disclosure provides a driving chip, a display substrate, a display device and a method for manufacturing a display device. The driving chip according to the present disclosure includes a substrate; and a plurality of connecting bumps and a plurality of supporting bumps disposed on the substrate. The plurality of connecting bumps include at least one set of connecting bumps arranged along a first direction, and the plurality of supporting bumps include the supporting bump that is located between the adjacent connecting bumps arranged along the first direction.