Dual Applicator Fluid Dispensing for Rotated Substrate Alignment
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Solution Overview
Problem
Traditional dual dispensing systems for viscous fluids fail to accurately dispense identical fluid patterns on substrates that are rotated or tilted relative to each other, as they do not perform active, real-time positional adjustments of the applicators in the XY plane or along the Z axis, leading to misalignment and inaccurate dispensing.
Innovation Solution
A dual applicator dispensing system with primary and secondary positioners that allow for simultaneous movement of the applicators in the X, Y, and Z axes, enabling active correction for misalignment by determining the precise positions and orientations of multiple dispense regions and adjusting the dispensing height paths to accommodate rotated or tilted substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional dual dispensing systems are used without active positional adjustment, then device complexity is reduced, but manufacturing precision deteriorates due to inability to correct for substrate rotation and tilt
Solution Approach 1:
The system implements dynamic positional adjustment of the second applicator relative to the first applicator during the dispensing process. The positioner actively corrects for substrate rotation and tilt in real-time, transforming the static dispensing system into a dynamic one that adapts to substrate orientation variations, thereby maintaining high dispensing accuracy without requiring overly complex pre-alignment mechanisms
Solution Approach 2:
The system incorporates feedback through the positioner that continuously monitors and adjusts the relative position between the first and second applicators. This feedback mechanism compensates for substrate rotation and tilt by actively modifying applicator positions based on detected misalignment, resolving the contradiction between maintaining precision and avoiding excessive system complexity
2Manufacturing precision
If active real-time positional adjustment is implemented, then manufacturing precision is improved, but device complexity increases due to additional positioner mechanisms
Solution Approach 1:
The positioning system is segmented into a primary positioner for the first applicator and a secondary positioner for the second applicator. This segmentation allows independent control and adjustment of each applicator, simplifying the overall control architecture while maintaining high precision. The secondary positioner is specifically designed to provide relative positional adjustment to the first applicator, dividing the complex positioning task into manageable segments
Solution Approach 2:
The system employs dynamic adjustment capabilities where the positioner can actively modify applicator positions during dispensing operations. This dynamic approach enables the system to adapt to substrate rotation and tilt in real-time, achieving high manufacturing precision without requiring overly complex static pre-alignment mechanisms
3Productivity
If dual applicators are used for simultaneous dispensing, then productivity is improved, but manufacturing precision deteriorates due to misalignment on rotated substrates
Solution Approach 1:
The system maintains high productivity through simultaneous dual dispensing while implementing dynamic positional adjustment to correct for substrate rotation and tilt. The positioner actively modifies the position of the second applicator relative to the first during dispensing, ensuring both applicators remain properly aligned with their respective substrates even when rotated, thus maintaining both productivity and precision
Solution Approach 2:
The feedback mechanism through the positioner continuously monitors the relative positions of the dual applicators and substrate orientations. This feedback enables real-time correction of misalignment caused by substrate rotation, allowing simultaneous dispensing to proceed with high precision while maintaining improved manufacturing throughput
4Manufacturing precision
If no active correction for rotation is performed, then device complexity is reduced, but manufacturing precision deteriorates due to local rotation and tilt of substrates
Solution Approach 1:
The system implements dynamic correction for substrate rotation and tilt through the positioner, which actively adjusts applicator positions during dispensing. This dynamic approach provides high fluid pattern accuracy by compensating for local rotation and tilt without requiring overly complex static correction mechanisms or pre-alignment procedures
Solution Approach 2:
The correction mechanism is segmented into a dedicated positioner system that handles rotational and tilt compensation independently from the main dispensing system. This segmentation allows the correction function to be implemented with minimal added complexity while maintaining high fluid pattern accuracy on rotated and tilted substrates
Data Source
AI summary
Methods of dispensing fluid are disclosed. A first applicator is positioned above a first dispense site at a first dispense region of a first electronic substrate by moving the first applicator using a primary positioner. A second applicator is simultaneously positioned above a first dispense site at a second dispense region of the first electronic substrate by moving the second applicator together with the first applicator using the primary positioner and moving the second applicator relative to the first applicator using a secondary positioner. It is then determined that the first or the second dispense region is misaligned relative to the other of the first or the second dispense region. Fluid is dispensed from the first applicator while moving the first applicator using the primary positioner to form a first fluid pattern at the first dispense region and fluid is simultaneously dispensed from the second applicator while moving the second applicator using the primary positioner and the secondary positioner.