Liquid Surface Applicators TRIZ Cases
- Pneumatic Ink Dispenser for Precise Camera Hole Sealing
Pneumatic pressure control and a detachable syringe enable precise ink deposition around camera holes to reduce light leakage and improve clarity.
- Adhesive Dispensing Nozzle With Tapered Ports to Prevent Clogging
Discrete droplet dispensing through tapered ports and a metering valve improves adhesive placement while reducing nozzle residue and clogging.
- Ultrathin Polymeric Interface Films for IC Adhesion Without Thermal Resistance
Ultrathin iCVD polymer films improve metal-dielectric and glass-dielectric adhesion on high-aspect surfaces without adding thermal resistance.
- Dispense Flow Synchronization for Gas Bubble Detection
Pressure and flow sensors detect bubble-induced delays in dispense lines, enabling synchronized coating control and more uniform film thickness.
- Wafer Cleaning Temperature Sequencing for Deep Pattern Penetration
Pre-heating a rotating substrate before chemical ejection helps liquid reach fine wafer patterns more deeply while limiting cleaning damage.
- Perforated Electrode Plate Coating for Faster Electrolyte Infiltration
Through-holes formed between two coating steps speed electrolyte infiltration while protecting active material integrity in dense electrode plates.
- Graphene Contact Deposition Through a Soluble Polymer Coating
A soluble polymer coating enables metal contact deposition on graphene without photolithography, reducing contamination and air exposure.
- Cable Gland Resin Dispensing With Integrated Mixing Chamber
Integrated storage, plunger dosing, and labyrinth mixing fill a cable gland accurately, reducing core disturbance, air voids, and waste.
- Substrate Processing Liquid Filtration With Dynamic Return Flow Control
Dynamic return-flow control keeps filter flow and particle capture stable during substrate liquid circulation and maintenance.
- Cam-Driven Intermittent Valve for High-Speed Electrode Coating
A rotating cam switches slurry supply on and off faster, enabling accurate high-speed intermittent coating for battery electrode plates.
- Wafer Backside N2 Purge for High-Viscosity Photoresist Coating
An N2 purge clears backside cotton-candy residue and bubbles during high-viscosity photoresist spin coating, keeping wafers clean and dry.
- Organic Radical Photoresist Stripping Without Semiconductor Damage
Hydrocarbon radicals selectively strip photoresist while passivating silicon or SiGe surfaces, avoiding hydrogen-plasma damage and extra steps.
- Structured Roller Transfer of Polymer Electrode Patches
Heated structured rollers or belts form polymer electrode patches directly on a substrate, avoiding punching or laser ablation.
- Selective MLD Carbon Blocking Layers for Dielectric Patterning
Selective carbon MLD on metal regions creates thicker, removable blocking layers for precise dielectric deposition under plasma and heat.
- Electrode Coating Die Structure for Uniform Multi-Region Slurry Coating
A shim plate and expansion plate split slurry flow across multiple discharge regions to reduce coating thickness variation in battery electrodes.