Substrate Processing Liquid Filtration With Dynamic Return Flow Control
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in efficiently managing the flow rate and particle content of processing liquids, which can lead to suboptimal processing conditions for semiconductor wafers and other substrates, particularly during maintenance operations.
Innovation Solution
The apparatus incorporates a controller that adjusts the flow rate of processing liquids through a filter and return pipes, ensuring a predetermined flow rate is maintained, and includes temperature control to optimize the capture of particles, thereby ensuring a consistent and clean processing liquid supply to processing units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the processing liquid flow rate is increased to improve processing speed, then productivity increases, but particle removal efficiency by the filter decreases
Solution Approach 1:
The system dynamically adjusts the flow rate of processing liquid through the filter based on operational conditions. The control unit varies the flow rate within a predetermined range to optimize both particle removal efficiency and processing productivity, transforming a static flow rate system into a dynamic one that adapts to different operational requirements
Solution Approach 2:
The invention changes the flow rate parameter of the processing liquid to resolve the contradiction. By adjusting this physical parameter within an optimal range, the system achieves both effective particle removal and maintained processing speed, addressing the trade-off between reliability and productivity
2Ease of manufacture
If a simple return pipe system is used to reduce device complexity, then ease of manufacture improves, but flow rate control precision deteriorates
Solution Approach 1:
The system incorporates flow rate detection means that continuously monitors the processing liquid flow rate and feeds this information back to the control unit. This feedback mechanism enables precise flow rate control while maintaining a relatively simple return pipe structure, resolving the contradiction between device simplicity and control precision
Solution Approach 2:
The invention introduces a control unit as an intermediary between the simple return pipe system and the flow rate requirement. This intermediary component processes detection signals and adjusts the pump operation to achieve precise flow rate control without requiring a complex return pipe structure
3Reliability
If the processing liquid is circulated continuously to maintain consistent quality, then processing reliability improves, but energy consumption increases
Solution Approach 1:
The system implements periodic or variable circulation of processing liquid rather than continuous operation at constant speed. The control unit adjusts the pump operation based on detected flow rates and processing conditions, creating a periodic action pattern that maintains liquid quality consistency while reducing overall energy consumption compared to continuous full-speed circulation
Solution Approach 2:
The circulation system is made dynamic by varying the pump speed and flow rate based on real-time conditions. This dynamic operation maintains processing liquid quality consistency when needed while reducing energy consumption during periods when full circulation is not required, resolving the contradiction between reliability and energy use
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures efficient particle removal and consistent processing liquid quality, even during maintenance, enhancing the processing efficiency and reliability of substrate processing operations.
Implementation Method 1
a pump that sends the processing liquid in the processing liquid tank to the circulation pipe
Implementation Method 2
a filter that filters the processing liquid flowing through the circulation pipe
Data Source
AI summary
A substrate processing apparatus 100 includes a processing unit, a reservoir 31, a processing liquid pipe 32, a pump 34, a filter 35, a first flow rate section 36, a first return pipe 51, a first adjustment valve 52, a second return pipe 41, a branch supply pipe 16, a second flow rate section 42, and a controller. The first flow rate section 36 is placed in the processing liquid pipe 32 and measures a flow rate or pressure of the processing liquid flowing through the processing liquid pipe 32. The first adjustment valve 52 is placed in the first return pipe 51 and adjusts a flow rate of the processing liquid flowing through the first return pipe 51. The controller controls an opening degree of the first adjustment valve 52 based on the flow rate or the pressure of the processing liquid measured by the first flow rate section 36.