Dual Chip Card Module Comb-Shaped Antenna Connections
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Solution Overview
Problem
The challenge is to develop a dual-type microcircuit module for miniaturized cards that meets mechanical performance standards, particularly in bending and torsion, while maintaining moderate production costs and flexibility in microcircuit geometry compatibility, without compromising dimensional tolerances.
Innovation Solution
A dual microcircuit module with a support film featuring external contact pads and internal antenna connection zones shaped like combs, allowing connection via wires through vias coated with resin, providing mechanical strength and flexibility by optimizing the arrangement of contact pads and resin coverage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the module dimensions are reduced to meet miniaturized card formats, then the card size is reduced, but the mechanical strength and ability to withstand bending/torsion stresses deteriorates
Solution Approach 1:
The support film is designed with specific mechanical properties to provide flexibility where needed while maintaining overall structural integrity. The film allows bending in certain areas to accommodate mechanical stresses while keeping the module compact
Solution Approach 2:
The module uses composite construction combining the support film, metallized contact pads, resin coating, and microcircuit mounted on a rigid substrate. This composite structure provides both the compact size needed for miniaturized cards and the mechanical strength to withstand bending and torsion stresses
2Area of moving object
If the external face is entirely metallized to provide sufficient contact pad surface area, then the contact pad surface area is increased, but the electrical isolation between contact pads deteriorates
Solution Approach 1:
The external face has non-uniform metallization with metallized contact pads in specific locations and non-metallized isolating zones between them. This local differentiation provides sufficient contact pad surface area for electrical connection while maintaining electrical isolation between adjacent pads through the non-conductive support film material
3Ease of manufacture
If the module format is reduced from M4 to M3 to lower production costs, then the production cost is reduced, but the dimensional tolerances for inserting operations worsen
Solution Approach 1:
The module uses a standardized support film format (M3) that is segmented into functional zones (contact pads, isolating zones, connection zones) with defined dimensional tolerances. This segmentation allows mass production at lower cost while maintaining precise dimensional control for inserting operations through careful design of each functional zone's dimensions
4Reliability
If the microcircuit is made rigid to protect confidential data, then the security is improved, but the flexibility to withstand mechanical stresses deteriorates
Solution Approach 1:
The support film provides mechanical flexibility to withstand bending and torsion stresses during card insertion and removal operations. The film acts as a flexible carrier that protects the rigid microcircuit while allowing the overall module to deform elastically under mechanical stress
Solution Approach 2:
The module combines the rigid microcircuit mounted on a rigid substrate with the flexible support film and resin coating. This composite structure allows the rigid microcircuit to maintain security while the flexible film absorbs mechanical stresses through elastic deformation
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates to a dual module for a dual chip card, which includes a supporting film 7 supporting on an outer surface a plurality of connecting pads (C1-C8) including two series of connecting pads extending in a given direction and, on an inner surface, two inner connection areas (9) intended for being connected to an antenna of said dual card and a chip 6, said chip including contact terminals connected by wires respectively to the inner connection areas or to certain electric connecting pads by means of holes (41-45) passing through said supporting film while being coated, together with said wires, by a mass of coating resin, characterised in that the series of electric connecting pads of the outer surface include only three pads (C1-C3, C5-C7) and in that each of the two inner connection areas forms a comb (20, 30) including a body extending under each of the pads of one of the two series of connecting pads separated from the coating mass, respectively, and blades, including two end blades starting at the ends of the body (20A-D, 30A-D), which extend separately from one another from said body until ends covered by the coating mass.