Dual-Circuit Coolant Routing for Low-Pressure EV Thermal Control

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Solution Overview

Problem

Existing temperature adjustment circuits for electric vehicles face increased pressure drop in circulation states and fail to efficiently cool two cooling targets using a single connection circuit.

Innovation Solution

A temperature adjustment circuit design that includes two separate temperature adjustment circuits connected via connection paths, with a switching mechanism allowing for circulation or non-circulation states, where the heat-transfer medium bypasses the first heat exchanging part in circulation state, reducing pressure drop and enabling simultaneous cooling of a battery and a power conversion device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the heat-transfer medium passes through the first cooler and second cooler in the circulation state, then two cooling targets can be cooled with one connection circuit, but pressure drop increases

Engineering Contradiction:
Improvecooling capabilityVSAvoidpressure drop
Core Design Contradiction:
Adaptability or versatilityVSStress or pressure

Solution Approach 1:

The patent applies dynamics by making the heat transfer path configurable through switching mechanisms. The system can dynamically switch between series connection (both coolers in circulation path) and parallel connection (bypassing first cooler) modes, allowing adaptation to different operating conditions to balance cooling capability with pressure drop management

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent segments the heat transfer path into multiple configurable routes by introducing switching mechanisms that can isolate or connect different components. The first cooler can be selectively included or excluded from the circulation path, creating distinct operational segments that can be activated based on system requirements

Inventive Principle:
Principle #1Segmentation

2Temperature

If the circulation state is established when outside air temperature is lower than predetermined temperature, then cooling efficiency is improved, but pressure drop increases

Engineering Contradiction:
Improvecooling efficiencyVSAvoidpressure drop
Core Design Contradiction:
TemperatureVSStress or pressure

Solution Approach 1:

The system dynamically adjusts the heat transfer configuration based on ambient temperature conditions. When outside air temperature is low, the system can operate in parallel mode bypassing the first cooler to reduce pressure drop while maintaining adequate cooling. When higher cooling efficiency is needed, it switches to series mode utilizing both coolers

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The circuit effectively cools two targets with one connection circuit while minimizing pressure drop by routing the heat-transfer medium without passing through the first heat exchanging part in circulation state, enhancing cooling efficiency and flexibility.

Implementation Method 1

a first heat exchanging part that transfers heat between the heat-transfer medium and an air-conditioning refrigerant

Methodology Applied
Scientific EffectHeat transfer: Heat Exchanger

Implementation Method 2

a second heat exchanging part that transfers heat between the heat-transfer medium and outside air

Methodology Applied
Scientific EffectHeat transfer: Heat Exchanger

Data Source

PatentUS11888139B2Temperature adjustment circuit
Publication Date: 2024.01.30 HONDA MOTOR CO LTD
  • US11888139B2 patent drawing
  • US11888139B2 patent drawing
  • US11888139B2 patent drawing

AI summary

A temperature adjustment circuit includes a first temperature adjustment circuit and a second temperature adjustment circuit in which a switching part that is configured to switch between a circulation state where a heat-transfer medium is circulated through a connection circuit in which the first temperature adjustment circuit and the second temperature adjustment circuit are connected to each other and a non-circulation state where the heat-transfer medium is not circulated through the connection circuit.