Dual-Side Cooling Power Module Step Structure for Thinner Chip Support
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Solution Overview
Problem
Conventional dual-side cooling power modules are hindered by spacers and pillars that increase area and thickness, impair heat dissipation, and complicate manufacturing, making miniaturization and performance improvement difficult.
Innovation Solution
A dual-side cooling power module design utilizing multilayer substrates with step structures on metal layers to support and electrically connect chips, eliminating the need for spacers and pillars, and enabling even heat dissipation from both sides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If spacers and pillars are disposed between substrates to support chips, then chips are mechanically supported and electrically connected, but module area and thickness increase, and heat dissipation performance deteriorates
Solution Approach 1:
The patent merges the mechanical support function and electrical connection function into a single integrated substrate structure. The substrate includes conductive patterns that simultaneously provide structural support and electrical pathways, eliminating the need for separate spacers and pillars. This integration reduces the overall module thickness while maintaining both mechanical strength and electrical connectivity.
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: it provides mechanical support for chips, establishes electrical connections between chips and external terminals, and facilitates heat dissipation through its conductive structure. This multi-functional design eliminates the need for dedicated support components, thereby reducing module volume.
2Stability of the object's composition
If spacers and pillars are used for chip support and connection, then mechanical stability is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple components (substrate, conductive patterns, support structures) into a single integrated structure. The substrate itself is designed with embedded conductive pathways that provide both mechanical stability and electrical connectivity, eliminating the need for separate spacer and pillar components. This reduces the number of assembly steps and simplifies the manufacturing process.
Solution Approach 2:
The substrate is designed with segmented conductive patterns that can be independently configured for different electrical connections while forming an integrated mechanical support structure. This segmentation allows for flexible circuit design and easier manufacturing through standardized fabrication processes.
3Strength
If conventional dual-side cooling structure with spacers is used, then chip is supported, but heat dissipation efficiency is poor
Solution Approach 1:
The patent removes the insulating spacer material that was blocking thermal pathways in conventional designs. By extracting this thermal barrier and replacing it with conductive substrate material, the design enables direct thermal coupling between chips and the cooling structure, significantly improving heat dissipation efficiency while maintaining mechanical support.
Solution Approach 2:
The substrate employs composite material structures with high thermal conductivity pathways integrated into the mechanical support framework. This allows the same structure to simultaneously provide mechanical strength and efficient heat transfer, eliminating the trade-off between support and heat dissipation.
Data Source
AI summary
The present disclosure relates to dual-side cooling power modules, manufacturing methods thereof, and electrical systems. There is provided a dual-side cooling power module, comprising: a first multilayer substrate, comprising: a first insulating material layer, a first metal layer, and a second metal layer, the second metal layer comprising a plurality of first step structures having a first height; a second multilayer substrate, comprising: a second insulating material layer, a third metal layer, and a fourth metal layer, the fourth metal layer comprising a plurality of second step structures having a second height; and one or more chips disposed between the first multilayer substrate and the second multilayer substrate and attached to the second metal layer and the fourth metal layer. Each chip is attached and supported between a corresponding first step structure and a corresponding second step structure and is electrically connected with them.