Dual-Drum IC Chip Plating for Mask-Free Differential Coating
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Solution Overview
Problem
Conventional plating methods for IC chips require multiple processes with masking materials, leading to increased time and cost, and result in adhesion issues and burning phenomena due to uneven plating areas, particularly on bonding surfaces.
Innovation Solution
A plating device and method utilizing a flexible belt and dual plating units with drums to apply different materials simultaneously to both surfaces of IC chips without masking, enabling efficient differential plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional plating method with masking is used to achieve differential plating on bonding surface and contact surface, then different materials can be plated on different surfaces, but the plating process needs to be conducted twice which increases time and cost
Solution Approach 1:
The patent divides the plating process into two separate plating units, each equipped with drums that can independently rotate. The first plating unit plates the bonding surface while the second plating unit plates the contact surface. This segmentation allows simultaneous differential plating on both surfaces without requiring sequential masking processes, thereby improving productivity while maintaining manufacturing precision.
Solution Approach 2:
The patent transitions from a single-sided plating approach to a dual-sided simultaneous plating approach by introducing a second plating unit with its own drum. This dimensional expansion from one plating zone to two independent plating zones enables both surfaces to be plated at the same time, eliminating the need for repeated processes and masking materials.
2Manufacturing precision
If masking method is used for differential plating, then different materials can be applied to different surfaces, but pressure and heat applied during masking weaken adhesion between encapsulant and IC device
Solution Approach 1:
The patent extracts and eliminates the masking step from the differential plating process. By using separate plating units with independent drums for each surface, the method achieves differential plating without requiring masking materials. This removal of the masking step prevents the application of pressure and heat that would otherwise weaken the adhesion between the encapsulant and the IC device.
Solution Approach 2:
The patent performs plating on both surfaces simultaneously from the beginning of the process, rather than sequentially with masking. The IC device is positioned between the two plating units and both surfaces are plated in one operation, preventing any subsequent heating or pressing that could compromise adhesion.
3Productivity
If conventional plating is applied to bonding surface with large area difference between bonding hole area and remaining portion, then plating can be completed, but burning phenomenon occurs due to uneven plating area distribution
Solution Approach 1:
The patent applies local quality control by using a drum in the first plating unit that can be selectively positioned. The drum rotates to expose only the bonding hole area to the plating solution, while the remaining portion is protected. This localized plating approach ensures uniform plating thickness in the bonding hole area without the burning phenomenon that occurs when large area differences are plated simultaneously.
Solution Approach 2:
The drum acts as an intermediary tool that mediates between the plating solution and the bonding surface. By rotating the drum, it controls the exposure of different areas to the plating solution, ensuring that only the bonding hole area receives plating while protecting the surrounding areas. This intermediary mechanism prevents uneven plating and burning phenomena.
4Manufacturing precision
If masking materials are used for differential plating, then different materials can be plated on different surfaces, but large amount of time and cost are required
Solution Approach 1:
The patent segments the plating system into two independent plating units, each with its own drum and plating solution supply. This segmentation enables simultaneous plating on both bonding surface and contact surface without requiring sequential operations or masking materials, thereby eliminating the time loss associated with repeated masking and unmasking steps.
Solution Approach 2:
The patent achieves continuous useful action by plating both surfaces of the IC device simultaneously in one operation. The first plating unit and second plating unit operate concurrently, with their respective drums rotating to apply plating to the bonding surface and contact surface at the same time. This continuous simultaneous action eliminates idle time and repeated processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces process time and cost while improving durability and adhesion by allowing simultaneous differential plating on both surfaces without burning, enhancing IC chip manufacturing efficiency.
Implementation Method 1
the first drum is configured to plate a first material on the first surface by providing a first plating solution to the first surface of the plurality of IC chip devices
Implementation Method 2
the second drum is configured to plate a second material on the second surface by providing a second plating solution to the second surface of the plurality of IC chip devices
Data Source
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AI summary
Disclosed are a plating device for manufacturing an integrated circuit (IC) chip, a plating method for manufacturing an IC chip, and a manufacturing method of an IC chip using the same. The disclosed plating device may include a first plating unit including at least one first drum; a second plating unit provided to be spaced apart from the first plating unit and including at least one second drum; and a flexible belt configured to move by being caught on the first drum and the second drum and in which a plurality of IC chip devices is arranged.