Dual-Emission LED Chip Structure for Two-Sided Light Output
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Solution Overview
Problem
Conventional LED chips emit light in only one direction, leading to increased thickness, power consumption, and manufacturing costs when attempting to emit light through two surfaces, necessitating multiple chip mounts.
Innovation Solution
A dual emission LED chip design utilizing a P-N junction with a P-layer and N-layer configuration that emits light in both upward and downward directions, allowing for single-chip dual emission without the need for separate packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional LED chips are mounted on each of the two surfaces to emit light in two directions, then light emission through two surfaces is achieved, but the thickness becomes thicker and device complexity increases
Solution Approach 1:
The LED chip is segmented into distinct P-layer and N-layer regions, with separate light emission paths from each layer. The P-layer emits light through the first surface while the N-layer emits light through the second surface, allowing dual-directional emission from a single chip structure without increasing thickness.
Solution Approach 2:
The invention transitions from conventional single-directional emission to dual-directional emission by utilizing the vertical dimension of the chip structure. Light is emitted in opposite directions along the thickness axis, with the P-layer emitting upward through the first surface and the N-layer emitting downward through the second surface.
2Illumination intensity
If multiple conventional LED chips are used to achieve dual emission, then light emission through two surfaces is achieved, but power consumption increases
Solution Approach 1:
The invention merges the functions of two separate LED chips into a single integrated chip structure. The P-layer and N-layer are formed within the same semiconductor substrate and share common electrical connections and packaging structures, enabling dual-directional light emission from one chip while reducing the total power consumption compared to operating two separate chips.
Solution Approach 2:
The single LED chip structure is designed to perform multiple functions: the P-layer provides light emission in one direction while the N-layer provides light emission in the opposite direction. This multi-functional design eliminates the need for separate chips and reduces overall system power consumption.
3Illumination intensity
If multiple conventional LED chips are used to achieve dual emission, then light emission through two surfaces is achieved, but manufacturing costs are increased
Solution Approach 1:
The manufacturing process merges the production of two separate LED chips into a single integrated structure. The P-layer and N-layer are formed sequentially within the same semiconductor substrate using standard epitaxial growth and fabrication techniques, eliminating the need for separate chip manufacturing, mounting, and wiring operations that would increase costs.
Solution Approach 2:
The dual-emission structure is built into the chip during the preliminary manufacturing stages through selective layer formation and electrode placement. The P-layer and N-layer are created in sequence during epitaxial growth, and the electrical connections are established before final packaging, simplifying the overall manufacturing process and reducing costs.
4Ease of manufacture
If conventional LED chip structure is used, then manufacturing is simpler, but total internal reflection of light is high and luminous efficiency is low
Solution Approach 1:
The invention applies different structural characteristics to different regions of the chip: the P-layer region is optimized for light extraction in one direction while the N-layer region is optimized for light extraction in the opposite direction. This localized optimization reduces total internal reflection at each interface and improves overall luminous efficiency while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design miniaturizes application apparatus, increases power efficiency, reduces manufacturing costs, and enhances luminous efficiency by reducing total internal reflection.
Implementation Method 1
an LED chip which uses an electroluminescence effect of a P-N junction including a P-layer (P) and an N-layer (N) provided below the P-layer (P)
Data Source
AI summary
Proposed is a dual emission LED chip that emits light to the upper and lower sides of a PN junction, wherein the duel emission LED chip uses the electroluminescent effect of the PN junction including a P layer and an N layer provided below the P layer, and characterized in that the dual emission LED chip emits light in the upward direction of the P layer and the downward direction of the N layer. The dual emission chip can be applied as a single chip to a field requiring dual emission, thereby enabling miniaturization of applied equipment, and increases power efficiency, thereby reducing manufacturing costs. In addition, as the dual emission LED chip can be manufactured through a batch process, a separate packaging process is not required.