Dual-Encapsulant Semiconductor Package for Warpage and Die Shift
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor device packages face reliability issues due to warpage and die-shifting phenomena, which affect the accuracy and integrity of the encapsulation process.
Innovation Solution
A semiconductor device package design featuring a first encapsulant surrounding the device, a second encapsulant covering both the device and the first encapsulant, and a redistribution layer extending through the second encapsulant for electrical connection, along with a manufacturing method that includes forming a cavity in the first encapsulant, disposing the semiconductor device within it, covering it with the second encapsulant, and forming the redistribution layer for electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single encapsulant is used to surround the semiconductor device, then the manufacturing process is simple, but warpage and die-shifting phenomena occur causing reliability issues
Solution Approach 1:
The encapsulation structure is divided into two separate encapsulants: a first encapsulant that surrounds the semiconductor device and a second encapsulant that covers both the device and the first encapsulant. This segmentation allows each encapsulant to perform specific functions, with the first providing direct protection and the second providing additional support and planarization, thereby preventing warpage and die-shifting while maintaining manufacturing feasibility
Solution Approach 2:
The first encapsulant is nested within the second encapsulant, creating a layered encapsulation structure. The semiconductor device is first surrounded by the first encapsulant, then the second encapsulant is formed to cover the entire assembly. This nested configuration provides enhanced structural support and distributes stress more evenly, eliminating warpage issues while preserving ease of manufacture through sequential processing steps
2Ease of manufacture
If the semiconductor device is directly attached to the carrier, then the attachment process is straightforward, but die-shifting phenomenon occurs affecting placement accuracy
Solution Approach 1:
The first encapsulant acts as an intermediary material between the semiconductor device and the carrier. Instead of directly attaching the device to the carrier, the device is first encapsulated in the first encapsulant, which is then attached to the carrier. This intermediary layer provides a compliant interface that absorbs thermal expansion differences and mechanical stresses, preventing die-shifting while maintaining straightforward attachment procedures
3Reliability
If a redistribution layer is added to extend through the second encapsulant for electrical connection, then electrical connectivity is improved, but device complexity increases
Solution Approach 1:
The redistribution layer is merged with the second encapsulant structure, extending through it to provide electrical connections. This integration allows the redistribution layer to serve dual purposes: maintaining electrical connectivity for the semiconductor device while simultaneously providing structural support and planarization as part of the second encapsulant assembly, thereby improving connectivity without proportionally increasing complexity
Data Source
AI summary
A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.