Dual Gas Supply Mechanism for Substrate Processing Apparatus
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Solution Overview
Problem
Conventional substrate processing apparatuses face challenges in miniaturization due to their configuration, particularly in the transfer chamber, which limits their size reduction and efficiency.
Innovation Solution
The apparatus incorporates a dual gas supply mechanism with upper and lower gas supply ports, featuring buffer chambers and ventilation units to create independent gas paths and flow rates, allowing for efficient gas distribution and ventilation within the transfer chamber, reducing the overall size and improving performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a conventional single gas supply mechanism is used in the transfer chamber, then the structure is simple, but the apparatus cannot be miniaturized and gas distribution efficiency is poor
Solution Approach 1:
The gas supply mechanism is segmented into upper and lower independent gas supply units, each with its own buffer chamber and ventilation unit. This segmentation allows compact vertical arrangement that reduces overall apparatus volume while maintaining effective gas distribution throughout the transfer chamber.
Solution Approach 2:
The patent transitions from a conventional horizontal gas supply arrangement to a vertical three-dimensional configuration with upper and lower gas supply ports. This dimensional change enables compact footprint while improving gas circulation efficiency and reducing apparatus size.
2Reliability
If gas is supplied through a single location in the transfer chamber, then the structure is simple, but pressure loss increases and cleaning performance deteriorates
Solution Approach 1:
The gas supply is segmented into upper and lower regions with independent control, allowing optimized gas flow paths that reduce pressure loss while enhancing cleaning effectiveness in different areas of the transfer chamber.
Solution Approach 2:
Different regions of the transfer chamber receive gas supply with locally optimized characteristics - the upper region receives gas from the upper buffer chamber while the lower region receives gas from the lower buffer chamber, ensuring appropriate gas flow rates and pressure for each specific cleaning requirement.
3Volume of moving object
If a compact gas supply structure is implemented, then apparatus size is reduced, but maintenance difficulty increases
Solution Approach 1:
The gas supply system is segmented into modular upper and lower units that can be independently accessed and maintained. This modular segmentation enables compact overall size while providing separate access paths for maintenance of each unit, reducing maintenance difficulty despite the compact configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the miniaturization of the substrate processing apparatus by reducing pressure loss, enhancing cleaning unit performance, and facilitating easier maintenance, while ensuring uniform cooling and efficient gas circulation, thereby improving productivity and cooling efficiency.
Implementation Method 1
By ventilating clean air from the cleaning unit into the transfer chamber, an air flow is formed inside the transfer chamber
Implementation Method 2
a lower gas supply mechanism disposed under the upper gas supply mechanism and configured to supply the gas into a lower region of the transfer chamber
Data Source
AI summary
A substrate processing apparatus including a transfer chamber; upper gas supply mechanism that supplies a gas into an upper region of the transfer chamber through a first gas supply port; and lower gas supply mechanism that supplies the gas into a lower region of the transfer chamber through a second gas supply port. The upper gas supply mechanism includes a first buffer chamber disposed at a back surface of the first gas supply port; a pair of upper ducts disposed at both sides of the first buffer chamber; and a first ventilation unit disposed at lower ends of the pair of upper ducts. The lower gas supply mechanism includes a second buffer chamber disposed at a back surface of the second gas supply port; a lower duct disposed at lower surface of the second buffer chamber; and a second ventilation unit disposed at a lower end of the lower duct.