Dual-Head Laser Machining with Rotating Support for Parallel Processing
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Solution Overview
Problem
Current laser processing apparatuses face challenges in efficiently performing various processes such as partial peeling and removal of unnecessary portions due to limitations in flexibility and precision.
Innovation Solution
A laser processing apparatus with a rotatable support portion and multiple laser processing heads that allow for controlled movement and emission of laser lights to form modified regions simultaneously, enabling efficient peeling and processing by forming spiral or linear patterns with precise control over focusing points and rotation speeds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single laser processing head is used, then the device complexity is low, but the productivity is insufficient due to sequential processing requirements
Solution Approach 1:
The laser processing system is segmented into multiple independent laser processing heads (first laser processing head and second laser processing head), each capable of independent operation. This segmentation allows parallel processing of different regions or aspects of the target, thereby increasing overall productivity without requiring each head to be overly complex
Solution Approach 2:
Multiple laser processing heads are designed with universal functionality to perform various laser processing operations (peeling, removal, modification) on different portions of the target. Each head can be independently controlled to perform different processes simultaneously, achieving multi-functionality at the system level while maintaining relatively simple individual head designs
2Productivity
If multiple laser processing heads are used, then the productivity increases through parallel processing, but the device complexity increases
Solution Approach 1:
The control systems of multiple laser processing heads are merged into a single integrated controller that coordinates all heads simultaneously. This merging approach allows centralized management of multiple heads, reducing the overall coordination complexity compared to having separate control systems for each head, while still enabling parallel processing operations
3Adaptability or versatility
If the support portion is rotatable, then the adaptability for various processing patterns is improved, but the device complexity increases
Solution Approach 1:
The support portion is designed with dynamic rotational capability, allowing it to rotate during laser processing operations. This dynamic adjustment enables the system to adapt to various processing patterns (spiral, circular, linear) and access different portions of the target from multiple angles, significantly improving versatility while the rotation mechanism itself remains a relatively simple mechanical component
4Manufacturing precision
If focusing points are precisely controlled, then the manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The system incorporates feedback mechanisms that continuously monitor the positions of focusing points generated by multiple laser processing heads. This feedback enables real-time adjustment and precise control of focusing point locations, achieving high manufacturing precision while the control complexity is managed through automated feedback loops rather than overly complex mechanical positioning systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances processing efficiency by allowing for simultaneous or parallel formation of modified regions, improving takt time and ensuring consistent pitches between processing spots, thereby reducing processing failures and achieving high-quality results.
Implementation Method 1
a first laser processing head configured to irradiate the target placed on the support portion with a first laser light to form a first modified region in the target; a second laser processing head configured to irradiate the target placed on the support portion with a second laser light to form a second modified region in the target
Data Source
AI summary
A laser processing apparatus includes a support portion, a first laser processing head, a second laser processing head, a first vertical movement mechanism, a second vertical movement mechanism, a first horizontal movement mechanism, a second horizontal movement mechanism, and a controller configured to control rotation of the support portion, emission of a first and a second laser lights from the first and the second laser processing heads, and movement of a first and a second focusing points.