Welding/Soldering/Cutting Articles TRIZ Cases

Beam splitting, DOE shaping, and powered spacing control enable simultaneous thin-film solar cell scribing with less dead area and higher throughput.

A tapered irradiation gap guides melt flow to form deep, wide, gas-tight laser welds while avoiding oxidation in sensitive or thin-walled parts.

Region-specific laser settings based on ingot optical characteristics create a uniform separation layer and reduce substrate irregularities.

Low-beryllium copper diffusion bonding uses oxide removal and post-bond heat treatment to retain joint strength through thermal shock and aging.

A 10-25 kW laser enables full penetration of 8-40 mm steel plates, avoiding extra electric welding, deformation, and long processing time.

A tapered stirring pin enters a softer auxiliary insert from one side, cutting device load while improving tool life and joint strength.

Coupled machine and process models coordinate real-time laser and motion setpoints to cut corners and small radii with fewer contour errors.

Pulsed laser texturing forms undercut anchor projections that preserve the anchor effect while increasing joint bonding strength.

A protective intermediate layer enables laser-based selective IC transfer without cracking, reducing etch steps and allowing donor substrate reuse.

Merged excimer laser exhaust is purified and xenon-enriched to stabilize gas composition, narrow linewidth, and reduce chromatic aberration.

A tapered shoulder imprints its wear state onto the workpiece surface, enabling tool abrasion checks without stopping friction stir spot welding.

Oscillating the laser across the lap joint inner corner increases weld metal thickness, preserving strength and gap tolerance at high speed.

Parallel laser heads and a rotating support form precise spiral or linear modified regions faster while keeping spot pitch consistent.

Focused laser ablation cuts battery electrode laminates without mechanical contact, reducing shards, damage, and short-circuit risk.

Carbonaceous interlayers and controlled heating create a carbon gradient at the steel joint, boosting strength and outer-periphery wear resistance.

Scanning a laser beam removes chamber process residue from ceramic parts while avoiding outgassing, base damage, and surface finish changes.

Placing the laser focus 10-30 mm above thick steel and keeping the nozzle close boosts oxygen cutting speed, cut quality, and lowers heat input.

Spot loading with a reduction ratio of 1.4 or more enables solid-phase bonding of dissimilar metals while suppressing fragile IMC formation.

A moving ultrashort laser focus forms local melt seams in transparent glass joints, reducing stress and optical impairment.

A Cu- and Ni-free steel composition with controlled C, Mn, and Cr improves laser cut quality in as-rolled and shot-blasted plate.

Controlled subsurface alloy enrichment and phosphorus-containing surfaces improve aluminum bond durability, corrosion resistance, and spot-welding electrode life.

A phosphorus-controlled weathering steel balances tensile strength, corrosion resistance, and solid-state weld reliability for durable structures.

In-situ cryogenic spray after laser cladding boosts cooling in age-hardening aluminum, raising surface hardness toward T6 without solution heat treatment.

Gradually reducing pin speed during tool exit helps friction stir welding preserve surface finish and avoid rotary tool damage.

Surface profile feedback adjusts wafer height during laser lift-off, keeping focus on warped GaN/sapphire wafers and improving yield.

Replacing copper with tin in sterling silver improves laser energy absorption, enabling chain-link welding at larger wire diameters.

Blue diode laser welding and tuned Al-Mg-Fe composition suppress porous welds in die-cast parts to achieve fluid-tight metal joints.

Roughened welded posts and matching through-holes raise laser absorptivity, deepen the molten pool, and reduce cracks and bubbles.

An inclined pressure-receiving surface redirects plastic flow during deep friction stir welding to suppress burrs and keep joint width narrow.

A rotating support and independently movable laser heads create multiple modified regions in parallel, speeding peeling and reducing separation failures.

A grooved coupling member removes melted aluminum during resistance welding, improving contact and fastening strength between dissimilar metal plates.

Cumulative femtosecond laser heating forms high-quality glass through-vias in under 120 μs, boosting throughput without acid etching.

By separating central and outer beams before collimation and focusing, this optical layout lowers rear-side laser intensity and damage.

Pressing the base-side pin against an auxiliary member keeps the tool on route, preventing metal shortage and weak corner joints.

Switching between time- and position-based triggering corrects delay and mode-switch errors for accurate laser emission on moving stages.

Coaxial OCT-guided scanner welding joins battery components without moving the laser head, cutting cycle time while maintaining weld depth and gastight seams.

A stepped friction stir weld forms a detectable coarse zone, preventing cavity defects and improving joint strength in aluminum liquid-cooling jackets.

Controlled pulsed laser ablation limits periodic surface artifacts and keeps diffraction severity low in transparent substrates for electrochromic mirrors.

Controlled laser cleaving propagates cracks along diamond {111} planes to avoid polishing damage, cut material loss, and create flat substrates.

A CO2 laser scanning process removes elastomer buildup from manufacturing equipment with higher precision, lower scrap, and longer tool life.

Focused laser ablation across the bonding interface separates bonded wafers with uniform cross-sections, less debris, and no cooling water.

Friction stir welding joins wrapped copper sheet flaps without preheating, cutting energy use while producing uniform, defect-free ingot mold seams.

A pulsed 355 nm UV laser marks TiO2-filled polymers at high speed with clear, permanent codes while limiting cratering and substrate damage.

A laser-formed internal crack layer plus peripheral cut groove removes immature cracks, enabling reliable ultrasonic wafer peeling with less waste.

Calculated stress fields and spot density place laser pulses in minimal lines to correct optical substrate figure errors on high aspect ratio parts.

Synchronized laser pulses, tube rotation, and linear motion cut precise pores and slots for longer-life filtration tubes with less waste.

A sliding third lens and galvo-scanned ring beam keep Bessel-like fluence uniform across positions, speeding via drilling with smoother walls.

Tilting the laser opposite the weld direction and shifting focus forward enlarges the keyhole so vaporized metal escapes without causing defects.

Repeated sliding under pressure discharges burrs at the interface, suppressing zinc mixing while preserving a galvanized joint surface.

An asymmetric curved focus zone enables laser machining along curved paths while guiding crack orientation for cleaner workpiece separation.