Laser Cleaning of Chamber Ceramics Without Outgassing Damage
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Solution Overview
Problem
Existing cleaning methods for substrate processing components, such as wet cleaning and polishing, can cause outgassing and alter or damage the ceramic base of components, leading to ineffective residue removal.
Innovation Solution
A method and apparatus using laser scanning to remove process residue from used components with a ceramic base, without causing outgassing or damaging the ceramic base, by controlling the energy density and motion of the laser beam.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wet cleaning and polishing is used to remove process residue, then the residue removal effectiveness is improved, but outgassing occurs and the ceramic base is damaged
Solution Approach 1:
The patent replaces the mechanical wet cleaning and polishing system with a laser-based cleaning system. The laser beam removes process residue through ablation without requiring mechanical contact or liquid chemicals, thereby eliminating outgassing and damage to the ceramic base while maintaining effective residue removal
Solution Approach 2:
The patent changes the cleaning mechanism from mechanical/chemical to optical energy-based. By controlling laser parameters such as power, pulse duration, and wavelength, the system achieves residue removal through controlled ablation that does not cause the harmful effects associated with traditional methods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes process residue from substrate processing components without altering or damaging the ceramic base, thereby preventing outgassing and maintaining the desired surface finish.
Implementation Method 1
at least partially removing the process residue by scanning a laser beam across the process residue
Data Source
AI summary
Methods and apparatus for cleaning a used component from a substrate processing chamber are provided. In some embodiments, the method includes obtaining a used component having a ceramic base and process residue that is generated as a byproduct in the substrate processing chamber and that is in direct contact with the ceramic base; and at least partially removing the process residue by scanning a laser beam across the process residue.


