Laser Spot Allocation for Optical Substrate Figure Correction

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for shaping optical substrates, such as thin mirrors, struggle to accurately correct figure errors and material removal rates, especially for low spatial frequency corrections on components with high aspect ratios, as traditional grinding and polishing techniques are inadequate.

Innovation Solution

A method involving the determination of a stress field with three components of stress for an optical substrate, using a computational model and calibration constants to allocate laser pulses into a minimum number of lines, which are then used to control a rotation stage, beam shaping, and laser firing parameters for surface shaping, allowing for controlled deformation and iterative correction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional grinding and polishing techniques are used for figure correction, then material removal can be achieved, but the correction accuracy for low spatial frequency errors is insufficient and the process is inadequate for high aspect ratio components

Engineering Contradiction:
Improvefigure correction accuracyVSAvoidprocess adequacy for high aspect ratio components
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces traditional mechanical grinding and polishing systems with a laser-based stress figuring system. The laser induces controlled stress states within the substrate to achieve figure correction, eliminating the inadequacies of mechanical methods for high aspect ratio components and low spatial frequency errors.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental parameter of material interaction from mechanical contact to optical stress induction. By controlling laser parameters (wavelength, pulse duration, intensity) and resulting stress states, the system achieves precise figure correction that is insensitive to the high aspect ratio of the workpiece.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If laser pulses are used to generate stress for substrate deformation, then controlled figure correction is achieved, but the complexity of determining optimal pulse positions and stress field distribution increases

Engineering Contradiction:
Improvefigure correction precisionVSAvoidstress field calculation and pulse allocation system
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent performs preliminary calculation of the stress field distribution and laser pulse position allocation before actual processing. By pre-determining the optimal pulse positions based on the desired stress states and figure correction goals, the system simplifies the real-time control complexity while maintaining high precision.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent transforms the complex stress field control problem into a manageable parameter optimization problem by defining specific stress states and their corresponding laser parameters. This parameter-based approach allows systematic determination of pulse positions without excessive system complexity.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If multiple laser pulses are arranged to achieve desired spot density, then accurate stress distribution is achieved, but the number of processing lines and time required increases

Engineering Contradiction:
Improvestress distribution accuracyVSAvoidprocessing speed and material removal rate
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent optimizes the parameter of spot density to balance stress distribution accuracy with processing efficiency. By calculating the minimum number of lines required to achieve the desired stress states, the system maintains precision while maximizing material removal rate and reducing processing time.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables precise figure correction with high material removal rates, achieving 5-15× height reduction and improving the accuracy of optical components by generating controllable stress states within the substrate, effectively addressing the limitations of traditional methods.

Implementation Method 1

An optical substrate can be deformed in a controlled way by generating stress near the substrate surfaces by creating local bending moments akin to thin film stress

Methodology Applied
Scientific EffectStress generation:

Data Source

PatentUS20240359267A1Optical system, laser spot position determination process, and calibration process for deterministically shaping substrates using laser pulses
Publication Date: 2024.10.31 THE ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIV OF ARIZONA
  • US20240359267A1 patent drawing
  • US20240359267A1 patent drawing
  • US20240359267A1 patent drawing

AI summary

Methods for determining laser pulse positions for shaping an optical element may comprise: determining a stress field for at least a portion of a substrate, wherein the stress field comprises at least three components of stress, wherein the stress field comprises a plurality of stress states for the at least a portion of the substrate; determining, based at least on the stress field and a calibration model, a spot density over the at least a portion of the substrate; determining, based on the spot density, a laser spot position allocation that arranges a number of laser pulses into a minimum number of lines that achieves the spot density; and causing, based on the laser spot position allocation, output of a machine program that coordinates a rotation stage, beam shaping, a translation stage, and a laser firing parameter for surface shaping of the at least a portion of the substrate.