Multi-Head Laser Machining With Rotating Support for Parallel Peeling
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Solution Overview
Problem
Current laser processing apparatuses are limited in their ability to efficiently perform various processes such as partial peeling and removal of unnecessary portions due to fixed laser irradiation mechanisms, which restrict their versatility and efficiency.
Innovation Solution
A laser processing apparatus with a rotatable support portion and multiple laser processing heads that can move in various directions, allowing for the formation of multiple modified regions simultaneously, with a controller to manage the rotation, laser emission, and movement of focusing points to achieve efficient peeling and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a fixed laser irradiation mechanism is used, then the device structure is simple, but the processing efficiency and versatility are limited
Solution Approach 1:
The laser processing system is divided into multiple independent laser processing heads (first laser processing head, second laser processing head, etc.), each capable of independent operation. This segmentation allows simultaneous processing of different regions, improving productivity while maintaining manageable complexity through modular design
Solution Approach 2:
The patent introduces rotational movement of the support portion, adding a rotational dimension to the traditional linear movement. This allows laser processing heads to access different circumferential positions of the target, significantly improving processing efficiency and versatility without substantially increasing device complexity
2Adaptability or versatility
If multiple laser processing heads are introduced, then processing versatility improves, but device complexity increases
Solution Approach 1:
Multiple laser processing heads are designed with similar structures and functionalities, each capable of performing various processing operations (peeling, removal, modification). This universal design approach improves processing versatility while controlling device complexity through standardized components
Solution Approach 2:
The support portion is designed to rotate, dynamically changing the relative positions between laser processing heads and the target. This dynamic configuration allows a fixed number of processing heads to effectively process multiple regions, improving versatility without proportionally increasing device complexity
3Productivity
If the support portion is made rotatable, then processing efficiency improves, but control complexity increases
Solution Approach 1:
The controller coordinates the rotational position of the support portion with the operation of laser processing heads, implementing feedback control. This ensures that lasers are activated at appropriate positions during rotation, improving processing efficiency while managing control complexity through synchronized operation
Solution Approach 2:
The rotational movement of the support portion enables continuous processing across different circumferential positions of the target. By maintaining continuous rotation during laser processing, the system improves efficiency without requiring complex stop-start control sequences
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and versatile processing by forming multiple modified regions in parallel, improving processing time and quality, and preventing processing failures like separation issues during peeling.
Implementation Method 1
a first laser processing head configured to irradiate the target placed on the support portion with a first laser light to form a first modified region in the target; a second laser processing head configured to irradiate the target placed on the support portion with a second laser light to form a second modified region in the target
Data Source
AI summary
A laser processing apparatus includes a support portion, a first laser processing head, a second laser processing head, a first vertical movement mechanism, a second vertical movement mechanism, a first horizontal movement mechanism, a second horizontal movement mechanism, and a controller configured to control rotation of the support portion, emission of a first and a second laser lights from the first and the second laser processing heads, and movement of a first and a second focusing points.