Dual Heat Spreader Semiconductor Package for Scalable Assembly
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Solution Overview
Problem
The semiconductor industry faces challenges in scaling down semiconductor integrated circuit (IC) devices due to increased complexities in processing and manufacturing, which require advancements in IC fabrication to maintain performance and efficiency.
Innovation Solution
The described manufacturing process involves forming interconnection structures on semiconductor wafers with multiple dielectric and conductive layers, conductive vias, and conductive pads, followed by passivation and seed layer formation, and subsequent deposition of conductive layers to create conductive posts and terminals, enabling efficient packaging and assembly of semiconductor dies into package structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor device feature size is scaled down to increase functional density, then production efficiency and performance are improved, but processing and manufacturing complexity increases
Solution Approach 1:
The patent segments the semiconductor manufacturing process into distinct modules: forming interconnection structures with multiple dielectric and conductive layers, creating conductive vias and pads, applying passivation layers, and forming heat spreader structures. This modular segmentation allows each subsystem to be optimized independently, managing the overall processing complexity while maintaining high functional density and production efficiency
2Productivity
If semiconductor device feature size is scaled down to increase functional density, then performance is improved, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is divided into separate fabrication stages for different functional components (interconnection structures, conductive elements, passivation layers, heat spreaders). This segmentation enables specialized processing techniques for each component, improving overall device performance while keeping manufacturing complexity manageable through standardized modular procedures
Solution Approach 2:
The patent applies preliminary actions by pre-forming interconnection structures with integrated dielectric and conductive layers before final device assembly. Seed layers are deposited in advance to facilitate subsequent conductive layer formation, and heat spreader structures are prepared with predetermined geometries. These preliminary actions streamline the manufacturing process, reducing complexity while enhancing device performance
Data Source
AI summary
A semiconductor device includes a substrate, a package structure, a first heat spreader, and a second heat spreader. The package structure is disposed on the substrate. The first heat spreader is disposed on the substrate. The first heat spreader surrounds the package structure. The second heat spreader is disposed on the package structure. The second heat spreader is connected to the first heat spreader. A material of the first heat spreader is different from a material of the second heat spreader.