Dual Insulator Layer for Organic Semiconductor Moisture Protection
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Solution Overview
Problem
Optoelectronic semiconductor components face challenges in protecting organic layers from external influences such as moisture, which can impair their functionality.
Innovation Solution
The use of a dual insulator layer structure, where a thin first insulator layer made of organic polymer and a second insulator layer made of inorganic material, along with an encapsulation, effectively isolates the organic semiconductor layer from the substrate and external influences, allowing for external electrical contacting while preventing moisture penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single insulator layer is used to isolate the organic semiconductor layer from the substrate, then the manufacturing process is simple, but the protection against external influences such as moisture is insufficient
Solution Approach 1:
The insulator layer is divided into two separate layers: a first insulator layer (organic polymer) in direct contact with the organic semiconductor layer, and a second insulator layer (inorganic material) on top. This segmentation allows each layer to perform its specialized function - the organic layer provides interface compatibility and the inorganic layer provides moisture barrier protection - thereby improving reliability without excessive complexity
Solution Approach 2:
The patent uses a composite structure combining two different insulator materials with complementary properties. The organic polymer (e.g., PMMA, polycarbonate) provides good interface properties with the organic semiconductor, while the inorganic material (e.g., silicon oxide, silicon nitride) provides superior moisture barrier properties. This composite approach resolves the contradiction by achieving enhanced protection through material combination rather than thickening a single layer
2Reliability
If the insulator layer is made thicker to improve moisture barrier, then protection against external influences improves, but the device structure becomes more complex and manufacturing more difficult
Solution Approach 1:
Instead of depositing a single thick insulator layer that would be manufacturingally challenging, the patent segments the insulation function into two thin layers. The first organic insulator layer can be applied by standard organic semiconductor deposition techniques, and the second inorganic insulator layer can be deposited by established inorganic thin-film processes, making the overall structure easier to manufacture than a single thick layer
Solution Approach 2:
The patent changes the material parameter (organic to inorganic) rather than just increasing thickness. This allows achieving superior moisture barrier properties through material selection (inorganic materials have inherently better barrier properties) rather than through thickness alone, simplifying the manufacturing process while improving reliability
3Device complexity
If the first insulator layer is made thinner to reduce device complexity, then manufacturing is easier, but protection against moisture penetration is reduced
Solution Approach 1:
The patent compensates for the thinness of the first organic insulator layer by introducing a second inorganic insulator layer with superior moisture barrier properties. The composite structure allows the first layer to remain thin (maintaining low device complexity) while the second layer provides the necessary moisture protection, resolving the contradiction between thickness and protection
Solution Approach 2:
The second inorganic insulator layer acts as an intermediary moisture barrier between the external environment and the first organic insulator layer. This intermediary layer protects the thinner first layer from moisture penetration, allowing the first layer to be made thinner without compromising overall protection, thus reducing device complexity while maintaining moisture barrier integrity
Data Source
AI summary
The invention relates to an optoelectronic semiconductor component (10) comprising a substrate (1), a first insulator layer (2), and a second insulator layer (3). Furthermore, the semiconductor component (10) comprises an organic semiconductor layer sequence (4) having an active area (4a) which, during operation, generates or receives light, a first electrode (5) and a second electrode (6), and encapsulation (7) which covers the organic semiconductor layer sequence (4) and the first insulator layer (2) completely and covers the second insulator layer (3) and the first electrode (5) or the second electrode (6) partially. Here, the first electrode (5) is arranged between the organic semiconductor layer sequence (4) and the first insulator layer (2), and the second electrode (6) is arranged on the organic semiconductor layer sequence (4), wherein the first electrode (5) and/or the second electrode (6) is/are at least partly arranged on the second insulator layer (3).