Dual-Interface IC Card Component Manufacturing Cost Reduction
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Solution Overview
Problem
Dual-interface IC cards, which offer both contact and contactless communication, are more expensive to manufacture than contact and contactless IC cards due to the inclusion of both electrical contacts and antennas, necessitating a cost-effective manufacturing method for their components.
Innovation Solution
The manufacturing of dual-interface IC card components involves using a single-sided contact base structure with an electrical contact layer and attaching antenna contact leads to form a dual-interface contact structure, which is more cost-effective than traditional prefabricated dual-interface contact tapes, employing a substrate with an adhesive layer to attach the antenna contact leads, and producing these components in mass quantities using prefabricated single-sided contact tapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If prefabricated dual-interface contact tape is used, then the card supports both contact and contactless interfaces, but the manufacturing cost increases
Solution Approach 1:
The patent divides the dual-interface contact structure into separate components: a single-sided contact base structure and separate antenna contact leads. This segmentation allows each component to be manufactured independently using simpler, less expensive processes, then assembled together to form the complete dual-interface structure.
Solution Approach 2:
The patent combines a single-sided contact base structure with antenna contact leads to create a dual-interface contact structure. By merging these components after partial fabrication, the patent achieves dual-interface functionality without requiring expensive prefabricated dual-interface contact tape.
2Adaptability or versatility
If etching or stamping technology is used to create dual-interface contact tape from scratch, then the card achieves dual-interface functionality, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent performs preliminary actions by pre-fabricating the single-sided contact base structure using standard, simplified processes before adding the antenna contact leads. This preliminary fabrication reduces the overall manufacturing complexity compared to creating the complete dual-interface structure from scratch using complex etching or stamping technology.
Solution Approach 2:
The patent employs simpler, more economical manufacturing approaches for the contact base structure and antenna leads, using standard adhesive attachment processes rather than expensive etching or stamping technology. This substitution of cheaper manufacturing methods reduces overall device complexity while maintaining functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the manufacturing cost of dual-interface IC card components by utilizing a cost-effective prefabricated single-sided contact base structure and antenna contact leads, making them more affordable than conventional dual-interface IC cards while maintaining functionality.
Implementation Method 1
applying an adhesive material to the substrate of the single-sided contact tape... attaching the antenna contact leads to the single-sided contact tape using the applied adhesive material
Data Source
AI summary
Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.