Dual Laminate Interposers for SIP Electrical Connectivity
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Solution Overview
Problem
The stacked arrangement of semiconductor components in System-in-Package (SIP) and Multi-Chip Module (MCM) devices limits horizontal space, leading to suboptimal placement and orientation of components, which complicates electrical connectivity and increases the risk of electrical interference and voids during encapsulation.
Innovation Solution
The use of interposers, which are adhesive-mounted semiconductor components that allow for the relocation and rerouting of bond pads to optimize electrical connections, enabling better alignment and connectivity between components in a vertical stack.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If semiconductor components are stacked vertically in SIP/MCM devices, then surface area usage is optimized, but electrical connectivity and component placement become more difficult
Solution Approach 1:
The patent introduces an interposer as an intermediary component between the substrate and stacked semiconductor dies. This interposer provides additional bond pads and routing layers that facilitate electrical connections without requiring direct horizontal placement of bond pads on the limited substrate surface. The interposer acts as a mediator that resolves the connectivity difficulty caused by vertical stacking.
Solution Approach 2:
The patent transitions from a two-dimensional substrate plane to a three-dimensional structure by introducing vertical interposers and stacked dies. This dimensional change allows bond pads to be arranged in multiple layers and positions, enabling electrical connectivity that would be impossible in a purely planar configuration while maintaining compact surface area usage.
2Volume of moving object
If components are forced into suboptimal locations due to reduced surface area, then vertical stacking is achieved, but electrical interference increases
Solution Approach 1:
The interposer serves as a mediator that allows components to be positioned in optimal locations relative to each other in the vertical dimension, rather than being forced into suboptimal horizontal positions. This vertical arrangement with the interposer between components reduces electromagnetic interference by increasing spatial separation and providing shielding paths.
3Reliability
If bond pads are connected through bond wires in stacked arrangement, then electrical connections are established, but connectivity is limited by available space
Solution Approach 1:
The patent adds vertical dimension to bond pad arrangement through the interposer structure. Bond pads can now be positioned on different vertical levels and connected through the interposer's internal routing, greatly increasing connectivity flexibility beyond what is possible with traditional planar bond wire connections.
4Area of stationary object
If vertical integration is increased to reduce surface area, then packaging efficiency improves, but voids and air pockets increase during encapsulation
Solution Approach 1:
The patent segments the package into distinct vertical layers (substrate, interposer, multiple die stacks) with controlled interfaces between them. This segmentation allows for better management of encapsulation material flow and reduces the formation of large voids by creating smaller, more manageable spaces between components that can be properly filled during molding.
Data Source
AI summary
There is provided a semiconductor device assembly with an interposer and method of manufacturing the same. More specifically, in one embodiment, there is provided a semiconductor device assembly comprising a semiconductor substrate, at least one semiconductor die attached to the semiconductor substrate, an interposer disposed on the semiconductor die, and a controller attached to the interposer. There is also provided a method of manufacturing comprising forming a first subassembly by coupling a substrate and a semiconductor die, and forming second subassembly by attaching a controller to an interposer, and coupling the first subassembly to the second subassembly.