Dual Laser Optics for Co-Focused Probe Pin Bonding
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Solution Overview
Problem
Conventional turntable-type probe pin laser bonding apparatuses face challenges in precisely controlling the power and density of laser beams due to separately arranged first and second laser optic modules with different focal points, leading to high defect rates and limitations in miniaturization and precision.
Innovation Solution
An integrated dual laser optic module is developed, where the first and second laser beams are overlappingly irradiated on a co-focus, allowing precise control of power and density through a body unit with laser connection units, a filter unit, and an overlapping laser emitting unit, eliminating spatial restrictions and enhancing bonding precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the first and second laser optic modules are completely separated and arranged independently with different focal points, then the device complexity is reduced and ease of manufacture is improved, but the manufacturing precision and bonding defect rate worsen
Solution Approach 1:
The patent merges the first and second laser optic modules into a single integrated dual laser optic module. The first laser beam and second laser beam are made to co-focus at the same focal point on the probe pin, allowing precise control of power and density during laser bonding. This integration resolves the technical contradiction by improving manufacturing precision while maintaining reasonable device complexity through modular design.
2Productivity
If the thickness of the probe pins is reduced to minimize the gap between probe pins, then the productivity and integration level are improved, but the reliability and susceptibility to damage worsen
Solution Approach 1:
The patent replaces manual mechanical handling of probe pins with an automated laser bonding system. The integrated dual laser optic module enables precise bonding of thin probe pins without the need for manual manipulation, thereby maintaining probe pin reliability while achieving high productivity and miniaturization.
3Device complexity
If manual handling of probe pins is used to transfer and load them, then the device complexity is reduced, but the manufacturing precision and defect rate worsen due to scratching and bending
Solution Approach 1:
The patent replaces manual mechanical handling with an automated laser bonding system. The integrated dual laser optic module performs precise bonding without requiring manual manipulation of probe pins, eliminating scratching and bending defects while maintaining reasonable device complexity through automation.
4Device complexity
If the grip module thickness is increased to enable probe pin handling, then the device complexity is reduced, but the manufacturing precision and minimum gap capability worsen
Solution Approach 1:
The patent replaces the mechanical grip module with a non-contact laser bonding system. The integrated dual laser optic module bonds probe pins without physical contact, eliminating the thickness constraint of grip modules and enabling smaller probe pin gaps while maintaining handling capability through automation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces the bonding defect rate and enables high integration and precision, allowing for the miniaturization of probe pins while improving the apparatus's operational efficiency.
Implementation Method 1
a laser filter unit equipped inside the body part and overlapping the first laser beam and the second laser beam that meet inside the body part to have a co-focus by being transmitted or reflected, respectively
Implementation Method 2
a laser bonding unit bonds the probe pins to the probe card by irradiating a laser beam respectively onto the solder paste of the probe pins
Data Source
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AI summary
To achieve the above purpose, a dual laser optic module of a turntable-type probe pin laser bonding apparatus of the present invention comprising: a pickup unit that rotates 360 degrees on the horizontal line and transfers the probe pin placed on the tray after holding it with a pin gripper consisting of a pair of clamps; a dipping unit applies solder paste to the probe pin transferred by the pickup unit; and a laser bonding unit bonds the probe pins to the probe card by irradiating a laser beam respectively onto the solder paste of the probe pins transferred from the dipping unit by the pickup unit, wherein a body unit of a circular or polygonal shape with an empty interior; a first laser connection unit connected in a first direction toward the inside of the body part to which a first laser beam of a specific wavelength band is incident; a second laser connection unit connected in a second direction orthogonal to the first direction toward the inside of the body part to receive a second laser beam of a specific wavelength band; a laser filter unit equipped inside the body part and overlapping the first laser beam and the second laser beam that meet inside the body part to have a co-focus by being transmitted or reflected, respectively; and an overlapping laser emitting unit emitting the overlapped laser beam in a third direction of the body part to have a co-focus by the laser filter part.