Dual-Layer Conductive Polymer Capacitor Cathodes for Moisture Retention

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Solution Overview

Problem

Solid electrolytic capacitors with conductive polymer cathodes face reliability issues due to low working voltage and poor moisture management, leading to high leakage currents and package integrity problems during surface mount technology (SMT) processes, where they are exposed to high temperatures and humidity.

Innovation Solution

A method involving a dual conductive polymer layer structure with a hydrophilic first layer and a hydrophobic second layer, where the first layer has a moisture content of at least 16 wt% and a moisture loss of no more than 5 wt% upon heating from 125°C to 175°C, using materials like hydrogels and molecular sieves to retain moisture and prevent leakage, while the hydrophobic layer acts as a barrier to prevent moisture escape.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a single-layer conductive polymer coating is applied to the anode, then the manufacturing process is simple, but the coating develops cracks and delaminates under thermal mechanical stress during SMT processes

Engineering Contradiction:
Improvecoating application simplicityVSAvoidcoating integrity under stress
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The single-layer conductive polymer coating is divided into multiple layers with different properties. The patent applies a first conductive polymer layer followed by a second conductive polymer layer, where each layer serves different functional purposes. This segmentation allows the coating system to accommodate thermal expansion differences and stress distribution, preventing crack formation and delamination while maintaining manufacturing feasibility through sequential deposition processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs composite material structure by combining different conductive polymer materials in multiple layers. The first layer and second layer are composed of different conductive polymer compositions with complementary properties, creating a composite coating system that exhibits enhanced mechanical strength, flexibility, and adhesion. This composite approach allows each layer to compensate for the weaknesses of the other under thermal mechanical stress.

Inventive Principle:
Principle #40Composite materials

2Reliability

If the conductive polymer layer has high moisture content to maintain conductivity, then electrical performance is improved, but moisture loss during SMT heating causes leakage current and package integrity problems

Engineering Contradiction:
Improveelectrical performance stabilityVSAvoidmoisture loss under heat
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent modifies the moisture content parameter of the conductive polymer layers by incorporating hydrophilic polymers and crosslinking agents. These modifications change the moisture retention characteristics of the polymer, allowing it to maintain optimal moisture levels for electrical conductivity while resisting moisture loss during SMT heating. The crosslinking structure specifically prevents excessive moisture evaporation at elevated temperatures.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces hydrophilic polymers and crosslinking agents as intermediary substances within the conductive polymer matrix. These intermediaries act as moisture reservoirs and retention agents, mediating between the conductive polymer's need for moisture to maintain conductivity and the requirement to prevent moisture loss during thermal processing. The intermediaries hold onto moisture molecules, releasing them slowly to maintain electrical performance without causing package integrity issues.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the reliability and leakage stability of solid electrolytic capacitors by maintaining a balanced moisture content during SMT processes, reducing leakage currents and ensuring package integrity under high temperature and humidity conditions.

Implementation Method 1

a first conductive polymer layer having a moisture content of at least 16 wt% and a moisture loss of no more than 5 wt% upon heating from 125°C to 175°C

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

The first conductive polymer layer comprises a polyanion and a first binder where the first binder is more hydrophilic than the second binder

Methodology Applied
Scientific EffectHydrogen bonding:

Implementation Method 3

a second conductive polymer layer over the first conductive polymer layer wherein the second conductive polymer layer comprises a polyanion and a second binder wherein the first binder is more hydrophilic than the second binder

Methodology Applied
Scientific EffectHydrophobic effect: Hydrophobe

Implementation Method 4

a moisture loss of no more than 5 wt% upon heating from 125°C to 175°C

Methodology Applied
Scientific EffectThermal energy storage: Thermal Energy Storage

Data Source

PatentEP2715753B1Conductive polymer dispersions for solid electrolytic capacitors
Publication Date: 2018.10.17 KEMET ELECTRONICS CORP
  • EP2715753B1 patent drawingFigure 1~2
  • EP2715753B1 patent drawingFigure 3
  • EP2715753B1 patent drawing

AI summary

A capacitor with an anode and a dielectric over the anode. A first conductive polymer layer is over the dielectric wherein the first conductive polymer layer comprises a polyanion and a first binder. A second conductive polymer layer is over the first conductive polymer layer wherein the second conductive polymer layer comprises a polyanion and a second binder and wherein the first binder is more hydrophilic than the second binder.