Hermetic sintered substrate eliminates mechanical etching, reducing height profile and increasing volumetric efficiency.
A porous electrode body receives a conductive polymer dispersion with high-boiling solvents to form a solid electrolyte layer.
Precise sulfuric acid levels inhibit dedoping and prevent electrode corrosion, ensuring stable capacitor performance.
A solid electrolytic capacitor uses a gel electrolyte to maintain oxide film repair capability through chemical gelling of organic solvents.
Replacing multiple metal layers with a single metal and doped semiconductor plate reduces manufacturing cost.
Hydrophilic and hydrophobic polymer layers maintain internal moisture during thermal processing to prevent leakage currents and package delamination.
Protruding anode lead-out part contacts external electrode through non-porous core to prevent air ingress and solid electrolyte deterioration.
A solid electrolytic capacitor uses a multi-layered cathode to improve adhesion between the electrolyte and valve-action metal substrate.
Laser welding fuses a cured conductive paste layer to the aluminum base, preventing dielectric oxide film damage and reducing leakage current.
Welding anode foil to a porous tantalum body eliminates lead wires, reducing height and increasing volumetric efficiency.
Replacing iron salts with persulfate oxidants and pre-loading dopants reduces leak current and improves heat resistance.
Embedding the anode lead in the sintered anode body removes bulky lead frames, increasing volumetric efficiency and capacitance density.
Incorporating a nonionic surfactant into the silver paste layer of a solid electrolytic capacitor enhances adhesiveness, reducing equivalent series resistance.
Cross-linker bonds electroconductive polymer particles to suppress time-related deterioration and maintain low equivalent series resistance in capacitors.
A controlled edge-to-center polymer thickness ratio in solid electrolyte capacitors reduces moisture influence and enhances reliability.