Dual-Layer Stage Structure for Lightweight Thermal Control

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Solution Overview

Problem

Existing stages for substrate processing apparatuses face challenges in achieving a balance between thermal conductivity, linear expansion coefficient, and weight, which affects the cooling performance and durability of the electrostatic chuck.

Innovation Solution

A stage comprising a dual-layer structure with a first member made of a lightweight material (density ≤ 5.0 g/cm3) and a second member made of a material with high thermal conductivity (≥ 100 W/mK) and low linear expansion coefficient (≤ 5.0×10−6/K), along with a flow passage for temperature control media.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a stage is made of a material with high thermal conductivity and low linear expansion coefficient, then the cooling performance and durability are improved, but the weight increases

Engineering Contradiction:
Improvecooling performance and durabilityVSAvoidweight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The stage is divided into two separate members: a first member made of lightweight material (density ≤ 5.0 g/cm³) and a second member made of material with high thermal conductivity (≥ 100 W/mK) and low linear expansion coefficient (≤ 5.0×10⁻⁶/K). These members are joined together to form an integrated structure that combines the advantages of both materials without the weight penalty of using the high-performance material throughout the entire stage.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The stage employs a composite structure consisting of two different materials with complementary properties. The first member provides lightweight characteristics while the second member provides high thermal conductivity and low thermal expansion. This composite approach allows the stage to achieve superior cooling performance and durability while maintaining reduced weight compared to using a single high-performance material.

Inventive Principle:
Principle #40Composite materials

2Weight of moving object

If a stage is made of a lightweight material, then the weight is reduced, but the thermal conductivity and linear expansion coefficient performance deteriorate

Engineering Contradiction:
ImproveweightVSAvoidthermal conductivity and linear expansion coefficient
Core Design Contradiction:
Weight of moving objectVSReliability

Solution Approach 1:

The stage is segmented into functional zones: the first member (lightweight material) handles structural support and weight reduction requirements, while the second member (high thermal conductivity, low expansion material) handles thermal management requirements. This segmentation allows each material to be optimized for its specific function rather than requiring a single material to excel at all properties.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the stage are made from materials with properties optimized for their specific functions. The first member uses lightweight material where weight reduction is critical, while the second member uses high-performance material where thermal conductivity and dimensional stability are critical. This local optimization resolves the contradiction between weight and thermal performance.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed stage design enhances the cooling performance of the electrostatic chuck, reduces the risk of cracking due to thermal expansion, and achieves a lightweight structure, thereby improving temperature controllability and operational efficiency.

Implementation Method 1

A flow passage for a temperature control medium is formed in at least one of the first member and the second member

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS12288676B2Stage and substrate processing apparatus
Publication Date: 2025.04.29 TOKYO ELECTRON LTD
  • US12288676B2 patent drawing
  • US12288676B2 patent drawing
  • US12288676B2 patent drawing

AI summary

A stage includes a first member made of a material having a density of 5.0 g/cm3 or less, and a second member joined to the first member. The second member is made of a material having a linear expansion coefficient of 5.0×10−6/K or less and a thermal conductivity of 100 W/mK or more. A flow passage for a temperature control medium is formed in at least one of the first member and the second member.