Dual-Layer Thermal Plate for Processor Cooling Redundancy
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Solution Overview
Problem
Existing cooling solutions for high-power IT equipment, such as servers, lack redundancy in thermal management, leading to a single failure point in cold plate modules, which can result in inadequate heat removal and system instability.
Innovation Solution
A thermal management plate module with a dual-layer design, featuring a single phase area and a phase change area, where the single phase layer is directly assembled on processing units and the phase change layer is self-sensing and self-regulating, allowing for operation in single phase, phase change, or hybrid modes to ensure continuous heat removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single cold plate module is used for cooling high-power processors, then the cooling system is simple in structure, but the system lacks redundancy and has a single failure point
Solution Approach 1:
The cold plate is divided into two independent layers: a first cold plate layer and a second cold plate layer. Each layer can function independently to provide cooling, eliminating the single failure point issue while maintaining manageable structural complexity through modular design
Solution Approach 2:
The dual-layer cold plate design provides built-in redundancy where the second layer serves as a backup cooling mechanism. This beforehand cushioning ensures that if one layer fails, the other can continue to provide cooling protection, preventing system failure before it occurs
2Temperature
If liquid cooling is implemented for high-power components, then effective heat removal is achieved, but the system becomes more complex compared to air cooling
Solution Approach 1:
The cold plate layers are designed to be self-contained units that directly contact the heat-generating components. The liquid cooling system serves itself by circulating through the integrated cold plate structure without requiring additional external cooling apparatus, reducing overall system complexity while maintaining effective heat removal
3Reliability
If a redundant dual-layer cold plate design is implemented, then cooling reliability is improved with backup capability, but the device complexity increases
Solution Approach 1:
The redundant cooling capability is achieved through segmentation into two distinct but simplified layers. Each layer is designed as a straightforward cooling structure that can independently perform the cooling function, providing redundancy without excessive complexity in each individual layer
Solution Approach 2:
Both the first and second cold plate layers are designed with universal cooling functionality, allowing either layer to independently provide the complete cooling function. This multi-functionality ensures reliability through redundancy while keeping each layer's design simple and standardized
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual-layer thermal management plate module provides redundant cooling mechanisms, ensuring reliable heat extraction and system stability by automatically switching to phase change mode when single phase cooling is insufficient, thereby preventing overheating and maintaining optimal operating temperatures.
Implementation Method 1
a first liquid inlet port coupled to the first cooling plate layer to receive a first cooling liquid into the single phase area and a first liquid outlet port coupled to the first cooling plate layer to expel the first cooling liquid from the single phase area
Implementation Method 2
a second liquid inlet port coupled to the second cooling plate layer to receive a second cooling liquid into the phase change and a vapor outlet port coupled to the second cooling plate layer to expel the second cooling liquid in a vapor state from the phase change area
Implementation Method 3
liquid circulates through the cold plate to remove the heat
Data Source
AI summary
A cooling plate module includes a first cooling plate layer having a single phase area within and a second cooling plate layer having a phase change area within. The first cooling plate layer includes a first liquid inlet port to receive a first cooling liquid into the single phase area and a first liquid outlet port to expel the first cooling liquid from the single phase area. The second cooling plate layer includes a second liquid inlet port to receive a second cooling liquid into the phase change and a vapor outlet port to expel the second cooling liquid in a vapor state from the phase change area, where the first cooling plate layer is in thermal contact with the second cooling plate layer, and the first cooling plate layer is in thermal contact with IT components to be cooled.