Modifications Using Liquid Cooling TRIZ Cases

Segmented primary and secondary condensers adjust cooling capacity dynamically through pressure-based vapor flow switching.

Segmenting refrigerant circuits allows a data center cooling assembly to use free cooling, reducing chiller energy consumption.

Perpendicular heat pipes on a boiler plate transfer heat from computing components to immersion fluid, managing high heat fluxes.

Segmented outdoor modules maintain cooling during main unit failure, reducing energy consumption and eliminating hot spots.

External trim cooling assembly provides adjustable sensible chilling to intake air before it enters the computing pod.

A jumping drop vapour chamber acts as a thermal diode between missile electronics and the outer skin.

Segmenting the cold plate into independent layers eliminates single failure points, ensuring continuous heat removal during high-power operation.

A sealed container uses a cold plate to cool electronic devices directly while a heat sink manages the primary cooling medium.

Selective cooling units reduce energy consumption by targeting heat at high-demand server racks.

A sealed enclosure uses dielectric fluid to transfer heat from electronics via conduction.

Angled and stepped faceplate ports shorten signal tracks to reduce power consumption while maintaining airflow for telecommunications shelves.

A multi-loop cooling system integrates dry coolers and liquid heat exchangers to manage thermal loads in data centers.

Heat pipes penetrate composite enclosure walls to create high conductivity paths for internal heat energy.

Partitions and guide holes form continuously bent flow channels that align liquid with vapor bubbles, increasing flow speed and critical heat flux density.

A three-layer immersion cooling architecture separates vapor and liquid subsystems to manage phase change flows independently.

A liquid spray cooling system directs coolant along heat sink fins to enhance drainage and heat transfer efficiency.

Eliminates separation plates in computing racks to reduce manufacturing costs while maintaining effective cooling through direct air circulation.

A pumped liquid cooling system circulates phase change refrigerant through a cold plate array to transfer heat away from electronic components.

A blended cooling system variably distributes fluid between adiabatic and evaporative modes to optimize thermal management.

Segmented arms apply downward force to maintain contact with the heat generating device while preserving the thermal interface area.

Movable fins in the cooling plate adjust to component geometry, reducing thermal resistance caused by misalignment.

Grooved porous surfaces facilitate smooth vapor movement and refrigerant circulation, reducing fluid resistance in high-density electronic cooling.

A reversible rotary fan adjusts airflow direction based on device enclosure orientation to maintain proper cooling pathways.

Phase change device extracts heat from server components using evaporator and condenser modules, eliminating water leakage risks in rack environments.

Two-phase cold plate loops manage heat from high-power compute devices by optimizing flow distribution and pressure drop to enhance facility efficiency.

Graded fluid diodes restrict reverse flow caused by boiling instabilities, maintaining stable heat transfer in microchannel cooling systems.

A two-phase cold plate uses a buffer to stabilize fluid flow between the evaporator and external condensing unit.

Embedding a vapor chamber inside a structural middle plate reduces device thickness while maintaining mechanical support and effective thermal management.

Independent unit cooling circuits connect to a stack loop thermosyphon, reducing energy consumption and maintenance complexity.

A closed-loop rack cooling system uses separate evaporator and condenser units to manage heat transfer efficiently.

A spine-and-leaf network switch redirects traffic to functional chips when components fail, maintaining throughput without replacing entire cards.

A modular immersion cooling system uses a condenser module to recover vaporized coolant from IT tanks.

Segmented liquid and air modules resolve complexity trade-offs, preventing local overheating in high-density data centers.

Parallel condensing loops with pressure sensors control main cooling sources to resolve thermal overload risks in high-density data center racks.

Interfacing flow controllers balance coolant distribution across server racks using direct sensor communication.

A thermosiphon system transfers heat from communication device interiors to external cold storage modules through evaporation and condensation cycles.

A sealed immersion cooling module condenses vapor-phase dielectric coolant back into liquid to maintain thermal contact with electronic devices.

A self-regulating fluid cooling system adjusts flow rate through parallel cold plates using dedicated regulation modules.

Mechanical latching joins vapor chamber plates, preventing distortion and preserving wick integrity during assembly.

A hyperbola cooling tower system adjusts compressor frequency to optimize refrigerant distribution across data center zones.

Phase change material modules absorb waste heat from non-uniform data center racks, maintaining optimal temperatures despite outside air quality variations.

A vaporization unit divided by a partition wall guides working fluid through a moving passage to exchange heat via phase change.

A coaxial fluid port merges supply and return channels into a single mounting structure to reduce connector count.

Segmented modules eliminate single points of failure while reducing infrastructure complexity for scalable data center cooling.

Stacked thermally conductive plates merge condensation and liquid-cooling spaces, eliminating multiple media interfaces that limit high-heat source application.

A cooling device with a vapor separation core separates vapor from liquid to resolve fluid management complexity in high-power density servers.

Eliminates vacuum brazing by merging shells and matrix into one additive manufactured part, reducing production costs and leak risks.

Protruding fins on the condenser cool both refrigerant and exhaust air, maintaining thermal performance during server maintenance.

A hybrid cooling system uses liquid-to-liquid and liquid-to-air heat exchangers to manage thermal loads in high density data center racks.

Metal foam in a cold plate cavity promotes smaller bubble formation and quicker detachment, reducing wall superheat at high heat fluxes.