Self-Adjusting Fluid Cooling System for Electronic Devices
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Solution Overview
Problem
Conventional cold plate heat dissipation devices for electronic devices are passive and cannot self-regulate flow rate, temperature, pressure loss, and other operating parameters, leading to thermal and hydraulic imbalances, increased system complexity, and inefficient energy use.
Innovation Solution
A self-regulating fluid cooling system that adjusts the flow rate of cooling fluid for each terminal based on its unique flow resistance characteristics and heat power consumption, using regulation modules with temperature measuring members, controllers, and valves to optimize heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional passive cold plate heat dissipation devices are used, then the system structure is simple, but thermal and hydraulic imbalance occurs and energy efficiency is poor
Solution Approach 1:
The cooling system is divided into multiple independent cooling circuits, each serving specific heating components. Each circuit can be independently controlled with its own regulation module, allowing customized flow rate adjustment for different thermal zones without affecting other parts of the system.
Solution Approach 2:
The system transitions from a static, fixed-flow configuration to a dynamic, adjustable-flow system. Regulation modules with controllable valves enable real-time modification of flow rates in each cooling circuit according to varying thermal demands of different heating components during operation.
2Device complexity
If conventional passive cold plate heat dissipation devices are used, then the device complexity is low, but heat dissipation efficiency is insufficient
Solution Approach 1:
Temperature sensors are integrated into each cooling circuit to monitor the thermal state of heating components. The control system receives temperature feedback and automatically adjusts valve openings in regulation modules to optimize flow rates, ensuring efficient heat dissipation while adapting to changing thermal conditions.
Solution Approach 2:
The system enables dynamic adjustment of flow rate parameters in each cooling circuit based on actual thermal demands. By changing the flow rate parameter adaptively rather than maintaining a fixed value, the system optimizes heat dissipation efficiency for different operating conditions and thermal loads.
3Device complexity
If uniform cooling is applied to all terminals, then the system design is simplified, but energy waste occurs due to different heat dissipation requirements
Solution Approach 1:
Each cooling circuit is designed with localized characteristics matching the specific thermal requirements of its served heating components. Different flow rates, pipe dimensions, and regulation capabilities are assigned to different circuits based on their individual heat dissipation needs, ensuring optimal cooling performance without energy waste.
4Ease of operation
If passive cooling systems are used, then the system is easier to operate, but flow rate and temperature regulation are insufficient
Solution Approach 1:
The control system automatically monitors temperature sensors and adjusts valve openings in regulation modules without requiring manual intervention. The system self-regulates flow rates in each cooling circuit based on real-time thermal conditions, maintaining optimal cooling performance while eliminating the need for complex manual operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances heat dissipation efficiency, reduces cooling costs, and improves the utilization rate and energy efficiency of electronic devices by adaptively regulating cooling fluid flow according to varying operating conditions.
Implementation Method 1
cooling fluid in the cooling fluid flow branch flows through the cold plate, and each cold plate is configured to be in contact and exchange heat with a corresponding heating region
Data Source
AI summary
The present invention relates to a self-adjusting fluid cooling system for an electronic device, comprising: cooling fluid flowing branches, the plurality of cooling fluid flowing branches being connected in parallel, and the cooling fluid flowing branches being connected to a cooling fluid driving member and a heat exchanger by means pipelines to form a fluid cooling circulation loop; cold plates, each cooling fluid flowing branch being provided with at least one cold plate, a cooling fluid in the cooling fluid flowing branches flowing through the cold plates, and each cold plate being used for contacting a corresponding heating area for heat exchange; and a plurality of adjusting modules, each adjusting module being provided corresponding to each cold plate, and the adjusting modules being configured to adjust the amount of the cooling fluid flowing through the corresponding cold plates.