Vapor Separation Core for Liquid Cooling System
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Solution Overview
Problem
Existing cooling systems for high-power density chips and servers lack effective vapor separation and redundant designs for two-phase coolant management, which are critical for efficient thermal management and fluid recirculation.
Innovation Solution
A cooling device with a vapor separation core and a direct liquid return channel, where the cooling layer is divided into separate regions to manage two-phase coolant, allowing for vapor extraction and liquid recirculation, and a server-level cooling system that integrates with a rack-level coolant loop for efficient heat extraction and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If two-phase cooling operations are implemented without vapor separation, then cooling capability is reduced, but system complexity increases due to inadequate fluid management
Solution Approach 1:
The cooling system is segmented into distinct functional regions: a first cooling region that generates mixed fluid, a vapor separation core that extracts vapor, and a second cooling region that receives separated liquid. This segmentation allows each component to perform its specific function efficiently, resolving the contradiction by organizing complex fluid management into manageable, specialized sections.
Solution Approach 2:
The vapor separation core acts as an intermediary component between the first and second cooling regions. It receives mixed fluid from the first cooling region, separates the vapor phase from the liquid phase, and delivers separated liquid to the second cooling region. This intermediary structure enables effective vapor-liquid separation without requiring complex external separation systems.
2Reliability
If redundant designs are not included for two-phase coolant, then system reliability is reduced, but manufacturing cost decreases
Solution Approach 1:
The system incorporates redundant coolant pathways and a direct liquid return channel that provides alternative fluid circulation routes. These redundant designs are built into the system architecture in advance, ensuring that if one pathway fails or becomes blocked, the system can continue operating through alternative routes, thereby maintaining high reliability without requiring complete system redesign.
3Productivity
If cooling layer is not divided into separate regions, then heat extraction efficiency is reduced, but device complexity decreases
Solution Approach 1:
The cooling layer is divided into a first cooling region and a second cooling region with different functional characteristics. The first cooling region is optimized for generating mixed fluid through intense heat extraction, while the second cooling region receives separated liquid and provides additional cooling. Each region has localized structural and operational characteristics tailored to its specific cooling task, maximizing overall heat extraction efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides efficient heat extraction, accommodates non-uniform power mapping on chips, ensures high reliability, and maintains a predetermined liquid balance, effectively managing thermal loads in high-power density environments.
Implementation Method 1
the internal region positioned on top of the cooling layer includes a vapor separation core. The first cooling region generates mixed fluid from two-phase coolant entering the first cooling region due to heat extracted from the chip. The vapor separation core operates to extract at least a portion of vapor from the mixed fluid
Implementation Method 2
The first cooling region generates mixed fluid from two-phase coolant entering the first cooling region due to heat extracted from the chip
Data Source
AI summary
A cooling device for cooling a chip, a server with such a cooling device, and a rack are disclosed. The cooling device comprises a cooling layer that is divided into multiple cooling regions; and an internal region that includes a vapor separation core. Two-phase coolant that enters a first cooling region of the cooling layer is converted to mixed fluid due to heat extracted from a corresponding region of the chip. The mixed fluid is elevated to the vapor separate core, which separates vapor from liquid in the mixed fluid. The vapor exits the cooling device while the liquid is transported to a second cooling region in the cooling layer. The cooling device can be used with a condenser in a server to form an internal server loop, and can be connected to a rack to form a main fluid loop. The two coolant recirculation loops are used together to maintain a predetermined liquid balance in the cooling device.