Server Heat Dissipation Assembly for Maintenance Efficiency
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Solution Overview
Problem
The heat dissipation efficiency of servers in a cabinet is reduced during maintenance, as the liquid-cooling plate must be removed, disrupting the cooling of other servers and reducing the temperature difference between cold and hot air, thereby affecting overall heat dissipation.
Innovation Solution
An electronic device with a heat dissipation assembly that includes an evaporator, condenser, and fin assembly, where the fin assembly protrudes from the outer surface of the condenser or liquid-cooling plate, allowing for cooling of both working fluid and hot air within the chassis without the need for a liquid-cooling plate on the air outlet, maintaining heat dissipation efficiency during maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the liquid-cooling plate is disposed on the air outlet of the server cabinet to cool the hot air, then the temperature difference between cold air and hot air is increased, but the liquid-cooling plate must be removed during server maintenance, disrupting the cooling of other servers
Solution Approach 1:
The patent combines the liquid-cooling plate function with individual server heat dissipation assemblies. Each server has its own evaporator, condenser, and fin assembly that can operate independently. The liquid-cooling plate is integrated into each server's internal structure rather than being a separate cabinet-level component, allowing servers to be maintained individually without affecting others.
Solution Approach 2:
The heat dissipation system is segmented into independent modules for each server. Each server contains its own evaporator, condensation space, and fin assembly that can function autonomously. This segmentation allows one server to be removed or maintained while others continue to operate with their cooling systems intact.
2Reliability
If the liquid-cooling plate is removed during server maintenance, then the hot air from remaining servers cannot be cooled, but keeping the liquid-cooling plate in place prevents maintenance access
Solution Approach 1:
The heat dissipation system is designed with dynamic capabilities where the liquid-cooling plate and associated components can be quickly installed or removed from individual servers. The evaporator and condenser assemblies are designed for rapid deployment and removal, allowing maintenance personnel to access servers without permanently blocking the air outlet.
Solution Approach 2:
The heat dissipation assembly including the liquid-cooling plate is pre-configured within each server unit. The evaporator is pre-positioned to contact the heat source, and the fin assembly is pre-arranged to extend into the air outlet path. This preliminary configuration ensures that cooling functionality is already established before the server is installed in the cabinet, eliminating the need for complex on-site assembly during maintenance operations.
3Productivity
If the fin assembly protrudes from the condenser or liquid-cooling plate, then both working fluid and hot air can be cooled simultaneously, but the structure becomes more complex
Solution Approach 1:
The fin assembly is merged with the condenser structure, forming an integrated heat dissipation component. The fins extend from the condenser outer surface into the air flow path, combining the functions of condensing the refrigerant and dissipating heat to the surrounding air in a single structural element. This integration eliminates the need for separate air-cooling components.
Solution Approach 2:
The fin assembly extends in a direction away from the condensation space, utilizing the spatial dimension available at the air outlet. By projecting the fins outward from the condenser surface into the air flow path, the system creates additional heat transfer surface area in the vertical or lateral dimension without increasing the footprint of the main condenser body.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively cools both the working fluid and hot air within the chassis, preventing a reduction in heat dissipation efficiency during server maintenance and eliminating the need for a liquid-cooling plate on the air outlet, thus maintaining consistent cooling performance.
Implementation Method 1
The evaporator is in thermal contact with the heat source
Implementation Method 2
the heat dissipation assembly not only can cool the working fluid in the condensation portion or the condensation space via the liquid coolant in the liquid-cooling space
Implementation Method 3
the heat dissipation assembly not only can cool the working fluid in the condensation portion or the condensation space via the liquid coolant in the liquid-cooling space, but also can cool the hot air in the chassis via the fin assembly
Implementation Method 4
The condensation space and the liquid-cooling space are not in fluid communication with each other. The condensation space is in fluid communication with the evaporator
Data Source
AI summary
An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed in the chassis. The heat dissipation assembly includes evaporator, condenser and fin assembly. The evaporator is in thermal contact with the heat source. The condenser has outer surface, condensation space and liquid-cooling space. The outer surface faces away from the condensation space and the liquid-cooling space. The condensation space and the liquid-cooling space are not in fluid communication with each other. The condensation space is in fluid communication with the evaporator. The liquid-cooling space is configured to be in fluid communication with the external heat dissipation device. The fin assembly is in thermal contact with the condenser and protrudes from the outer surface of the condenser along direction away from the condensation space or the liquid-cooling space.