Vapor Chamber Mechanical Latching Structure
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Solution Overview
Problem
Vapor chambers used in cooling electronic circuitry are limited by the boiling point of the working fluid, and existing assembly methods like soldering or brazing can be impractical for high volume production, especially when an internal wick structure is present, leading to potential distortion and damage.
Innovation Solution
A mechanical latching structure with parallel rows of 'L'-shaped protrusions on the upper lid and solid blocks with grooves on the base plate that interlock to secure the plates together without the need for soldering or brazing, maintaining planarity and preventing distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If soldering or brazing is used to bond the pillar-like support structure between the upper lid and base plate, then the temperature limitation of the vapor chamber is overcome, but the manufacturing complexity and difficulty of achieving consistency increase significantly
Solution Approach 1:
The patent replaces the thermal joining process (soldering/brazing) with a mechanical interlocking system. The lid and base plate each have complementary mechanical features (protrusions and recesses) that engage to form the support structure, eliminating the need for high-temperature bonding processes and their associated consistency issues.
Solution Approach 2:
The support structure is segmented into discrete mechanical features distributed across the lid and base plate surfaces. Rather than requiring a continuous bonded joint, multiple separate interlocking elements provide the necessary structural support while simplifying the assembly process.
2Temperature
If soldering or brazing is used to bond the pillar-like support structure, then the temperature limitation is overcome, but the internal wick structure is damaged and the braze joint integrity is compromised
Solution Approach 1:
The mechanical interlocking system replaces thermal joining processes that would expose the wick structure to damaging temperatures. By using room-temperature mechanical assembly, the wick maintains its structural integrity and functional properties.
3Temperature
If traditional bonding methods are used, then the vapor chamber can operate above the boiling point of the working fluid, but planarity distortion occurs and envelope rupture may happen
Solution Approach 1:
The mechanical interlocking system provides rigid structural support without the thermal distortion associated with soldering or brazing. The complementary mechanical features maintain precise alignment and planarity while enabling operation above the working fluid's boiling point.
Data Source
AI summary
A vapor chamber structure which locks the upper planar plate lid to the lower planar plate base without the need for brazing and prevents distortion of the surfaces from internal pressure in the chamber. The basic structure has parallel rows of latching structures on the interior surfaces of the upper planar plate lid and the lower planar plate base. Each row of latching structures has a cross section in the shape the letter “L” with the top of the “L” attached to the interior surface of the lid so that the horizontal sections of the “L”s face the lower planar base plate when the chamber is assembled.